Datasheet

Exposed Pad

Connect to GND

5 IADJ

6 FB

3 BOOT

1 SW

2 VIN

4 GND

7 SS

Exposed Pad

Connect to GND

IADJ

BOOT

VIN

GND

LM22673

SNVS586N –SEPTEMBER 2008–REVISED APRIL 2013

www.ti.com

Connection Diagram

Figure 1. 8-Lead Plastic SO PowerPAD Package

Package Number DDA0008B

Figure 2. 7-Lead Plastic PFM Package

Package Number NDR0007A

PIN DESCRIPTIONS

Pin Numbers

SO PowerPAD Name Description Application Information

PFM Package

Package

1 3 BOOT Bootstrap input Provides the gate voltage for the high side NFET.

2 - NC Not Connected Pin is not electrically connected inside the chip. Pin does

function as thermal conductor.

3 5 IADJ Current limit adjust input pin A resistor attached between this pin and GND can be

used to set the current limit threshold. Pin can be left

floating and internal setting will be default.

4 6 FB Feedback input Feedback input to regulator.

5 7 SS Soft-Start pin Used to increase soft-start time. See Soft-Start section

of data sheet.

6 4 GND Ground input to regulator; system System ground pin.

common

7 2 VIN Input voltage Supply input to the regulator.

8 1 SW Switch output Switching output of regulator.

EP EP EP Exposed Pad Connect to ground. Provides thermal connection to PCB.

See Application Information.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Product Folder Links: LM22673