Datasheet

0
20
40
60
80
100
120
140
160
180
0 50 100 150 200
T - Case Temperature - °C
C
Safety Limiting Current - mA
V = V = 5.5 V
CC1 CC2
ISO3080, ISO3086
ISO3082, ISO3088
www.ti.com SLOS581E – MAY 2008–REVISED SEPTEMBER 2011
THERMAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Low-K Thermal Resistance
(1)
168
θ
JA
Junction-to-Air °C/W
High-K Thermal Resistance 96.1
θ
JB
Junction-to-Board Thermal Resistance 61 °C/W
θ
JC
Junction-to-Case Thermal Resistance 48 °C/W
V
CC1
= V
CC2
= 5.25 V, T
J
= 150°C, C
L
= 15 pF,
P
D
Device Power Dissipation 220 mW
Input a 20 MHz 50% duty cycle square wave
(1) Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface mount packages.
Figure 15. DW-16 θ
JC
Thermal Derating Curve per IEC 60747-5-2
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Product Folder Link(s): ISO3080, ISO3086 ISO3082, ISO3088