Datasheet
ISO3080, ISO3086
ISO3082, ISO3088
SLOS581E – MAY 2008–REVISED SEPTEMBER 2011
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IEC 60664-1 RATINGS TABLE
PARAMETER TEST CONDITIONS SPECIFICATION
Basic isolation group Material group IIIa
Rated mains voltage ≤ 150 V
RMS
I-IV
Installation classification Rated mains voltage ≤ 300 V
RMS
I-III
Rated mains voltage ≤ 400 V
RMS
I-II
IEC 60747-5-2 INSULATION CHARACTERISTICS
(1)
over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS SPECIFICATION UNIT
Maximum working insulation
V
IORM
560 V
voltage
Method b1, V
PR
= V
IORM
× 1.875,
V
PR
Input to output test voltage 1050 V
100% Production test with t = 1 s, Partial discharge < 5 pC
V
IOTM
Transient overvoltage t = 60 s 4000 V
R
S
Insulation resistance V
IO
= 500 V at T
S
>10
9
Ω
Pollution degree 2
(1) Climatic Classification 40/125/21
REGULATORY INFORMATION
VDE CSA UL
Approved under CSA Component Recognized under 1577 Component
Certified according to IEC 60747-5-2
Acceptance Notice Recognition Program
(1)
File Number: 40016131 File Number: 220991 File Number: E181974
(1) Production tested ≥3000 VRMS for 1 second in accordance with UL 1577.
IEC SAFETY LIMITING VALUES
Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry.
A failure of the IO can allow low resistance to ground or the supply and, without current limiting, dissipate
sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system
failures.
PARAMETER MIN TYP MAX UNIT
Safety input, output, or supply θ
JA
= 168°C/W, V
I
= 5.5 V, T
J
= 170°C,
I
S
DW-16 157 mA
current T
A
= 25°C
T
S
Maximum case temperature DW-16 150 °C
The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum
ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the
application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the
Thermal Characteristics table is that of a device installed in the JESD51-3, Low Effective Thermal Conductivity
Test Board for Leaded Surface Mount Packages and is conservative. The power is the recommended maximum
input voltage times the current. The junction temperature is then the ambient temperature plus the power times
the junction-to-air thermal resistance.
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