Datasheet

PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
INA101AG NRND CDIP SB JD 14 1 Green (RoHS &
no Sb/Br)
AU N / A for Pkg Type
INA101AM NRND TO-100 LME 10 20 Green (RoHS &
no Sb/Br)
AU N / A for Pkg Type
INA101AM2 OBSOLETE TO-100 LME 10 TBD Call TI Call TI
INA101CM NRND TO-100 LME 10 100 Green (RoHS &
no Sb/Br)
AU N / A for Pkg Type
INA101CM1 OBSOLETE TO-100 LME 10 TBD Call TI Call TI
INA101HP ACTIVE PDIP N 14 25 Green (RoHS &
no Sb/Br)
CU NIPDAU N / A for Pkg Type
INA101HPG4 ACTIVE PDIP N 14 25 Green (RoHS &
no Sb/Br)
CU NIPDAU N / A for Pkg Type
INA101KU ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
INA101KU/1K ACTIVE SOIC DW 16 1000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
INA101KU/1KE4 ACTIVE SOIC DW 16 1000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
INA101KUE4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
INA101SG1 OBSOLETE TO-100 LME 10 TBD Call TI Call TI
INA101SM NRND TO-100 LME 10 20 Green (RoHS &
no Sb/Br)
AU N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 25-May-2009
Addendum-Page 1