Datasheet

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ABSOLUTE MAXIMUM RATINGS
(1)
DAC8814
SBAS338D – JANUARY 2005 – REVISED SEPTEMBER 2006
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION
(1)
MINIMUM
RELATIVE DIFFERENTIAL SPECIFIED TRANSPORT
ACCURACY NONLINEARITY TEMPERATURE PACKAGE- PACKAGE ORDERING MEDIA,
PRODUCT (LSB) (LSB) RANGE LEAD DESIGNATOR NUMBER QUANTITY
DAC8814ICDBT Tape and Reel, 250
DAC8814C ± 1 ± 1 – 40 ° C to +85 ° C SSOP-28 DB
DAC8814ICDBR Tape and Reel, 2500
DAC8814IBDBT Tape and Reel, 250
DAC8814B ± 4 ± 1.5 –40 ° C to +85 ° C SSOP-28 DB
DAC8814IBDBR Tape and Reel, 2500
(1) For the most current specifications and package information, see the Package Option Addendum located at the end of this document, or
see the TI website at www.ti.com .
DAC8814 UNIT
V
DD
to GND –0.3 to +8 V
V
REF
to GND –18 to +18 V
Logic inputs and output to GND –0.3 to +8 V
V(I
OUT
) to GND –0.3 to V
DD
+ 0.3 V
A
GND
X to DGND –0.3 to +0.3 V
Input current to any pin except supplies ± 50 mA
Package power dissipation (T
J
max – T
A
)/ θ
JA
W
Thermal resistance, θ
JA
28-Lead shrink surface-mount (RS-28) 100 ° C/W
Maximum junction temperature (T
J
max) 150 ° C
Operating temperature range, Model A –40 to +85 ° C
Storage temperature range –65 to +150 ° C
ESD rating, HBM 3000 V
ESD rating, CDM 500 V
(1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. This is a stress rating only;
functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum conditions for extended periods may affect device reliability.
2
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