Datasheet

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ABSOLUTE MAXIMUM RATINGS
(1)
DAC8801
SLAS403B – NOVEMBER 2004 – REVISED FEBRUARY 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION
(1)
MINIMUM
RELATIVE DIFFERENTIAL SPECIFIED TRANSPORT
ACCURACY NONLINEARITY PACKAGE- PACKAGE TEMPERATURE PACKAGE ORDERING MEDIA,
PRODUCT (LSB) (LSB) LEAD DESIGNATOR RANGE MARKING NUMBER QUANTITY
Tape and Reel,
DAC8801 ± 1 ± 0.5 MSOP-8 DGK -40 ° C to 85 ° C F01 DAC8801IDGKT
250
Tape and Reel,
DAC8801 ± 1 ± 0.5 MSOP-8 DGK -40 ° C to 85 ° C F01 DAC8801IDGKR
2500
Tape and Reel,
DAC8801 ±1 ±0.5 SON-8 DRB -40 ° C to 85 ° C E01 DAC8801IDRBT
250
Tape and Reel,
DAC8801 ±1 ± 0.5 SON-8 DRB -40 ° C to 85 ° C E01 DAC8801IDRBR
2500
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or refer to our
web site at www.ti.com.
over operating free-air temperature range (unless otherwise noted)
DAC8801 UNITS
V
DD
to GND –0.3 to 7 V
Digital Input voltage to GND –0.3 to +V
DD
+ 0.3 V
V
OUT
to GND –0.3 to +V
DD
+ 0.3 V
Operating temperature range –40 to 105 ° C
V
REF
, R
FB
to GND –25 to 25 V
Storage temperature range –65 to 150 ° C
Junction temperature range (T
J
max) 125 ° C
Power dissipation (T
J
max – T
A
) / R
ΘJA
W
Thermal impedance, R
ΘJA
55 ° C/W
Lead temperature, soldering Vapor phase (60s) 215 ° C
Lead temperature, soldering Infrared (15s) 220 ° C
ESD rating, HBM 4000 V
ESD rating, CDM 1000 V
(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
2
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