Information

18 | Signal Chain Guide 2013 Texas Instruments
Amplifiers and Comparators
High-Speed Amplifiers (>50 MHz)
High-Speed Amplifiers
SHDN
Supply
Voltage
(V)
A
CL
(min)
BW
at A
CL
(MHz)
(typ)
BW
G = +2
(MHz)
(typ)
GBW
Product
(MHz)
(typ)
Slew
Rate
(V/µs)
Settling
Time
0.10%
(ns)
(typ)
V
N
(nV/√Hz)
(typ)
V
OS
(mV)
(max)
I
B
(µA)
(max)
I
Q
Per
Ch.
(mA)
(typ)
I
OUT
(mA)
(typ)
Distortion
1 V
PP
,
G = 25 MHz
Device Ch.
HD
2
(dBc)
(typ)
HD
3
(dBc)
(typ)
HiRel
Avail.
Package Price*
Voltage Feedback (Sorted by Ascending ACL Bandwidth)
LMH6645/46
/47
1, 2, 1
N / N
/ Y
2.5 to 12 1 55 55 55 22 125 –72, 1 MHz 62, 1 MHz 17 3 2 pA 0.725 20
N
SOT, SOIC, MSOP
0.71/1.05/
0.58
THS4051/52
1, 2 N ±5, ±15 1 70 38 240 60 –72, G=2 –90, G=2 14 10 6 8.5 100
Y
SOIC, MSOP
PowerPAD™
0.95
THS4281
1 N
+2.7, ±5,
+15
1 90 40 35 78 –69, 1 MHz –76, 1 MHz 12.5 30 0.5 750 30
N
SOT23-5, MSOP,
SOIC
0.95
OPA2889
2 Y 5, ±5 1 115 60 75, G > 20 250 25 –80 –82 8.4 5 0.75 0.46 40
N
MSOP, SOIC 1.20
LMH6618/19
1, 2 Y / N 2.7 to 11 1 130 53 64 / 57, G = 10 55 90 –75, 1 MHz –75, 1 MHz 10 0.6 2.4 pA 1.3 35
N
SOT, SOIC 1.19 /1.79
LMH6642/
43/44
1, 2, 4 N 2.7 to 12.8 1 130 46 130 135 68 –65, 1 MHz –80, 1 MHz 17 5 2.6 pA 2.7 115
N
SOT, SOIC, TSSOP,
MSOP
0.66/0.79/
1.30
LMH6626
2 N 5 to 12 10 160 1300, G = 10 360 14 –65, 10 MHz –80, 10 MHz 1 0.5 20 pA 12 100
N
SOIC, MSOP 2.05
LM6171/72
1, 2 N 5.5 to 34 1 160 62 100
3600/
3000
48, 65 –50, 5 MHz –50, 5 MHz 12 6 / 3 3 pA 4 / 3 135 / 85
N/Y
PDIP, SOIC 1.21/1.60
THS4081/82
1, 2 N ±5, ±15 1 175 70 230 43 –63, G=2 –73, G=2 10 7 6 3.4 85
N
SOIC, MSOP
PowerPAD
1.20
OPA2614
2 N 5, ±6 2 180 180 290, G ≥ 20 145 35 –92, 1 MHz –110, 1 MHz 1.8 1 14.5 6.5 350
N
SOIC, SOIC
PowerPAD
1.95
LMH6624
1 N 5 to 12 10 180 1500, G = 10 400 14 –65, 10 MHz –80, 10 MHz 0.92 0.5 20 pA 12 100
N
SOT, SOIC 1.86
OPA2836
2 Y 2.5 to 5.5 1 205 100 118 560 30 4.6 0.4 1 1 50 85 105
N
MSOP-10, SOIC-8,
QFN-10
1.50
OPA836
1 Y 2.5 to 5.5 1 205 100 118 560 30 4.6 0.4 1 1 50 85 105
Y
QFN-10, 6SOT23 0.90
LM7171
1 N 5.5 to 36 2 220 220 200 4100 42 –55, 5 MHz –75, 5 MHz 14 1 10 pA 8.5 100
Y
PDIP, SOIC 1.06
THS4221/22
1, 2 N
3, 5, ±5,
15
1 230 100 120, G > 10 975 25 –90 –100 13 10 3 14 100
N
SOIC, MSOP
PowerPAD
.095
OPA2613
2 N 5, ±6 1 230 110 125, G ≥ 20 70 40 –95 –97 1.8 1 10 6 350
N
SOIC, SOIC
PowerPAD
1.55
OPAy354/57
1, 2, 4 Y 2.5 to 5.5 1 250 90 100, G = 10 150 30
–75, 1 MHz,
2 Vpp
–83, 1 MHz,
2 Vpp
6.5 8 50 pA 4.9 100
Y
SOT23, SOIC
PowerPAD
0.70
LMH6601
1 Y 2.4 to 5.5 1 250 130 155 275 50 –73, 10 MHz –56, 10 MHz 10 2.4 50 pA 9.2 150
N
SOT 0.65
OPA699
1 N 5, ±5 4 260 1000, G = 6 1400 7 –67, 2Vpp –87, 2 Vpp 4.1 5 10 15.5 120
Y
SOIC 1.95
LMH6657/58
1, 2 N 3 to 12 1 270 100 140 700 35 –57, 5 MHz –70, 5 MHz 11 5 20 pA 6.5 45
N
SOIC, MSOP, SC70 0.67/0.95
OPAy890
1, 2 Y 5, ±5 1 275 92 130, G > 20 400 10 –102 –94 8 6 1.6 2.25 40
N
MSOP, SOIC 0.75
THS4031/32
1, 2 N ±5, ±15 1 275 100 220 100 60 –81, THD 1.6 2 6 8.5 90
Y
SOIC, MSOP
PowerPAD
1.80
THS4011/12
1, 2 N ±5, ±15 1 290 50 310 37 –84, G=2 –96, G=2 7.5 6 6 7.8 110
Y
SOIC, MSOP
PowerPAD
1.85
OPAy830
1, 2 ,4 N
+3, +5,
±5
1 310 120 110, G ≥ 10 600 42 –71 –77 9.5 1.5 10 4.25 150
N
SOT23, SOIC 0.50
THS4631
1 N ±15 1 325 105 210, G > 20 1000 40 –76 –94 7 0.26 100 pA 11.5 98
N
SOIC, SOIC, MSOP
PowerPAD
3.55
LMH6611/12
1, 2 Y 2.7 to 11 1 345 112 135, G = 10 460 67 –82, 5 MHz –80, 5 MHz 10 0.6/ 0.75 10.1 pA 3.2 120
N
SOT, SOIC 0.70/0.95
OPA842
1 N ±5 1 350 150 200 400 15 –94 –93 2.6 1.2 35 20.2 100
N
SOT23, SOIC 1.55
OPA657
1 N ±5 7 350 1600, G > 40 700 10 –74, G = 10
–106, G
= 10
4.8 1.8 20 pA 14 70
N
SOT23, SOIC 4.10
OPAy300/301
1 Y 2.7 to 5.5 1 400 80 150 80 30
–74, 1 MHz,
G = 2
–79, 1 MHz,
G = 2
3 5 0.5 12 40
N
SOT23, SOIC 0.75
OPA2822
2 N 5, ±5 1 400 200 240, G ≥ 20 170 32 –95 –105 2 1.2 12 4.8 150
N
SOIC, MSOP 1.35
OPA656
1 N ±5 1 400 185 230, G > 10 290 8 –74 –100 6 2 20 pA 25 60
N
SOT23, SOIC 3.65
OPAy356
1, 2 N 2.5 to 5.5 1 450 100 200, G = 1 300 30
–81, 1 MHz,
G = 2
–93, 1 MHz,
G = 2
5.8 9 50 pA 8.3 60
Y
SOT23, SOIC,
MSOP
0.70
OPAy355
1, 2, 3 Y 2.5 to 5.5 1 450 100 200, G ≥ 10 300 30
–81, 1 MHz,
G = 2
–93, 1 MHz,
G = 2
5.8 9 50 pA 8.3 60
N
SOT23, SOIC,
MSOP, TSSOP
0.70
OPA698
1 N 5, ±5 1 450 215 250, G ≥ 5 1100 –74, 2 Vpp –87, 2 Vpp 5.6 5 10 15.5 120
Y
SOIC 1.90
OPAy690
1, 2, 3 Y 5, ±5 1 500 220 300, G > 10 1800 8 –77 –81 5.5 4 8 5.5 190
N
SOT23, SOIC,
SSOP
1.35
OPA843
1 N ±5 3 500 800, G = 5 1000 7.5 –96, G = 5 –110, G = 5 2 1.2 35 20.2 100
N
SOT23, SOIC 1.60
OPAy846
1, 2 N ±5 7 500 1750, G ≥ 40 625 10 –100, G = 10
–112, G
= 10
1.2 0.6 19 12.6 80
N
SOT23, SOIC 1.70
OPA847
1 Y ±5 12 600 3800, G ≥ 50 950 10 –105, G = 20
–105, G
= 20
0.85 0.5 39 18.1 75
N
SOT23, SOIC 2.00
OPA2652
2 N ±5 1 700 200 200, G ≥ 10 335 –76 –66 8 7 15 5.5 140
N
SOT23, SOIC 1.15
OPAy820
1, 4 N 5 to ±5 1 800 240 280, G ≥ 20 240 18 –90 –110 2.5 0.75 17 5.6 110
N
SOIC, SOIC
PowerPAD
0.90
LMH6609
1 N 6 to 12 1 900 280 900 1400 15 –63, 20 MHz –57, 20 MHz 3.1 2.5 5 pA 7 90
N
SOT, SOIC 0.94
LMH6629
1 Y 2.7 to 5.5 10 1000 4000 1100 42 –74, 1 MHz –88, 1 MHz 0.69 0.78 23 pA 15.5 250
N
SOT, WSON 1.88
*Suggested resale price in U.S. dollars in quantities of 1,000. See www.ti.com/hirel for HiRel options.