Datasheet

PACKAGE OPTION ADDENDUM

www.ti.com

18-Oct-2013

Addendum-Page 5

Orderable Device Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

CD74HC4053PWR ACTIVE TSSOP PW 16 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU | CU SN Level-1-260C-UNLIM -55 to 125 HJ4053

CD74HC4053PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -55 to 125 HJ4053

CD74HC4053PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -55 to 125 HJ4053

CD74HC4053PWT ACTIVE TSSOP PW 16 250 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -55 to 125 HJ4053

CD74HC4053PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -55 to 125 HJ4053

CD74HC4053PWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -55 to 125 HJ4053

CD74HCT4051E ACTIVE PDIP N 16 25 Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type -55 to 125 CD74HCT4051E

CD74HCT4051EE4 ACTIVE PDIP N 16 25 Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type -55 to 125 CD74HCT4051E

CD74HCT4051M ACTIVE SOIC D 16 40 Green (RoHS

& no Sb/Br)