Datasheet

Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
CD74HCT4051M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
CD74HCT4052M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
CD74HCT4053M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
CD74HCT4053PWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
CD74HCT4053PWRG4 TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
CD74HCT4053PWT TSSOP PW 16 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD74HC4051M96 SOIC D 16 2500 364.0 364.0 27.0
CD74HC4051M96G3 SOIC D 16 2500 364.0 364.0 27.0
CD74HC4051M96G4 SOIC D 16 2500 333.2 345.9 28.6
CD74HC4051PWR TSSOP PW 16 2000 364.0 364.0 27.0
CD74HC4051PWRG4 TSSOP PW 16 2000 367.0 367.0 35.0
CD74HC4051PWT TSSOP PW 16 250 367.0 367.0 35.0
CD74HC4052M96 SOIC D 16 2500 364.0 364.0 27.0
CD74HC4052M96G4 SOIC D 16 2500 333.2 345.9 28.6
CD74HC4052NSR SO NS 16 2000 367.0 367.0 38.0
CD74HC4052PWR TSSOP PW 16 2000 364.0 364.0 27.0
CD74HC4052PWRG4 TSSOP PW 16 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Oct-2013
Pack Materials-Page 2