Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD74HC30M96 SOIC D 14 2500 367.0 367.0 38.0
CD74HC30MT SOIC D 14 250 367.0 367.0 38.0
CD74HC30NSR SO NS 14 2000 367.0 367.0 38.0
CD74HC30PWR TSSOP PW 14 2000 367.0 367.0 35.0
CD74HC30PWT TSSOP PW 14 250 367.0 367.0 35.0
CD74HCT30M96 SOIC D 14 2500 367.0 367.0 38.0
CD74HCT30MT SOIC D 14 250 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2