Datasheet
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
CD74HC30M96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD74HC30MT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD74HC30NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD74HC30PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
CD74HC30PWT TSSOP PW 14 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
CD74HCT30M96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD74HCT30MT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1