Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD74HC240M96 SOIC DW 20 2000 367.0 367.0 45.0
CD74HC241M96 SOIC DW 20 2000 367.0 367.0 45.0
CD74HC244M96 SOIC DW 20 2000 367.0 367.0 45.0
CD74HCT240M96 SOIC DW 20 2000 367.0 367.0 45.0
CD74HCT240PWR TSSOP PW 20 2000 367.0 367.0 38.0
CD74HCT240PWT TSSOP PW 20 250 367.0 367.0 38.0
CD74HCT241M96 SOIC DW 20 2000 367.0 367.0 45.0
CD74HCT244M96 SOIC DW 20 2000 367.0 367.0 45.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2