Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLogic ICsLogic IC - Buffer, driver SOIC 20

Data sheet acquired from Harris Semiconductor

SCHS287B − Revised January 2004

This data sheet is applicable to the CD54/74AC240, CD54ACT240, and CD54/74ACT241. The CD54/74AC241 were not acquired from

Harris Semiconductor. See SCHS244 for information on the CD74ACT240, CD74AC244, and CD74ACT244.

The CD74AC240 and CD74ACT240 are supplied in 20-lead dual-in-line

plastic packages (E suffix) and 20-lead small-outline packages (M and

M96 suffixes). The CD74AC241 is supplied in 20-lead dual-in-line plastic

packages (E suffix) and the CD74ACT241 is supplied in 20-lead

dual-in-line plastic packages (E suffix) and 20-lead small-outline

packages (M96 suffix). The CD74AC244 and CD74ACT244 are supplied

in 20-lead dual-in-line plastic packages (E suffix), 20-lead small-outline

packages (M and M96 suffixes), and 20-lead shrink small-outline

packages (SM96 suffix). These package types are operable over the

following temperature ranges: Commerical (0 to 705C); Industrial (−40

to +855C); and Extended Industrial/Military (−55 to + 1255C).

The CD54AC240 and CD54AC244 and the CD54ACT240, CD54ACT241,

and CD54ACT244 are supplied in 20-lead hermetic dual-in-line ceramic

packages (F3A suffix) and are operable over the −55 to +1255C

temperature range.

The RCA CD54/74AC240, CD54/74AC241, and CD54/74AC244 and the

CD54/74ACT240, CD54/74ACT241, and CD54/74ACT244 3-state octal

buffer/line drivers use the RCA ADVANCED CMOS technology. The

CD54/74AC/ACT240 and CD54/74AC/ACT244 have active-LOW output

enables (1OE

, 2OE). The CD54/74AC/ACT241 has one active-LOW (1OE)

and one active-HIGH (2OE) output enable.

Summary of content (17 pages)

PAGE 1
Data sheet acquired from Harris Semiconductor SCHS287B − Revised January 2004 The RCA CD54/74AC240, CD54/74AC241, and CD54/74AC244 and the CD54/74ACT240, CD54/74ACT241, and CD54/74ACT244 3-state octal buffer/line drivers use the RCA ADVANCED CMOS technology. The CD54/74AC/ACT240 and CD54/74AC/ACT244 have active-LOW output enables (1OE, 2OE). The CD54/74AC/ACT241 has one active-LOW (1OE) and one active-HIGH (2OE) output enable.
PAGE 2
For TA = -40 to +85°C (Package Type E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 mW For TA = -40 to +70°C (Package Type M) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 mW For TA = +70 to +85°C (Package Type M) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PAGE 3
PAGE 4
PAGE 5
PAGE 6
PAGE 7
PACKAGE OPTION ADDENDUM www.ti.
PAGE 8
PACKAGE OPTION ADDENDUM www.ti.
PAGE 9
PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
PAGE 10
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device CD74AC240M96 Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 CD74AC244M96 SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 CD74AC244SM96 SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.
PAGE 11
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74AC240M96 SOIC DW 20 2000 367.0 367.0 45.0 CD74AC244M96 SOIC DW 20 2000 367.0 367.0 45.0 CD74AC244SM96 SSOP DB 20 2000 367.0 367.0 38.0 CD74ACT240M96 SOIC DW 20 2000 367.0 367.0 45.0 CD74ACT241M96 SOIC DW 20 2000 367.0 367.0 45.0 CD74ACT244M96 SOIC DW 20 2000 367.0 367.0 45.
PAGE 12
PAGE 13
PAGE 14
PAGE 15
PAGE 16
MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters.
PAGE 17
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.