Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLogic ICsLogic IC - Gate AND gate 4000B TSSOP 14

Data sheet acquired from Harris Semiconductor

SCHS057C – Revised September 2003

The CD4073B, CD4081B, and CD4082B types

are supplied in 14-lead hermetic dual-in-line

ceramic packages (F3A suffix), 14-lead

dual-in-line plastic packages (E suffix), 14-lead

small-outline packages (M, MT, M96, and NSR

suffixes), and 14-lead thin shrink small-outline

packages (PW and PWR suffixes).

Summary of content (31 pages)

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Data sheet acquired from Harris Semiconductor SCHS057C – Revised September 2003 The CD4073B, CD4081B, and CD4082B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes).
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information.
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PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device CD4073BM96 Package Package Pins Type Drawing SOIC SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4073BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 CD4073BPWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD4073BM96 SOIC D 14 2500 346.0 346.0 33.0 CD4073BNSR SO NS 14 2000 346.0 346.0 33.0 CD4073BPWR TSSOP PW 14 2000 346.0 346.0 29.0 CD4081BM96 SOIC D 14 2500 346.0 346.0 33.0 CD4081BNSR SO NS 14 2000 346.0 346.0 33.0 CD4081BPWR TSSOP PW 14 2000 346.0 346.0 29.
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MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing CD4073BM96 SOIC D 14 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 16.4 6.5 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 9.0 2.1 8.0 16.0 Q1 CD4073BMT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4073BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD4073BM96 SOIC D 14 2500 367.0 367.0 38.0 CD4073BMT SOIC D 14 250 367.0 367.0 38.0 CD4073BNSR SO NS 14 2000 367.0 367.0 38.0 CD4073BPWR TSSOP PW 14 2000 367.0 367.0 35.0 CD4081BM96 SOIC D 14 2500 367.0 367.0 38.0 CD4081BMT SOIC D 14 250 367.0 367.0 38.0 CD4081BNSR SO NS 14 2000 367.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.