Datasheet

Device Package

Type

Package

Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm)

Pin1

Quadrant

CD4053BM96 SOIC D 16 2500 330.0 16.8 6.5 10.3 2.1 8.0 16.0 Q1

CD4053BM96G3 SOIC D 16 2500 330.0 16.8 6.5 10.3 2.1 8.0 16.0 Q1

CD4053BM96G4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1

CD4053BPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1

CD4053BPWRG3 TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1

CD4053BPWRG4 TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

CD4051BM96 SOIC D 16 2500 333.2 345.9 28.6

CD4051BM96 SOIC D 16 2500 367.0 367.0 38.0

CD4051BM96 SOIC D 16 2500 364.0 364.0 27.0

CD4051BM96G3 SOIC D 16 2500 364.0 364.0 27.0

CD4051BM96G4 SOIC D 16 2500 367.0 367.0 38.0

CD4051BM96G4 SOIC D 16 2500 333.2 345.9 28.6

CD4051BPWR TSSOP PW 16 2000 364.0 364.0 27.0

CD4051BPWR TSSOP PW 16 2000 367.0 367.0 35.0

CD4051BPWRG4 TSSOP PW 16 2000 367.0 367.0 35.0

CD4052BM96 SOIC D 16 2500 364.0 364.0 27.0

PACKAGE MATERIALS INFORMATION

www.ti.com 3-Aug-2017

Pack Materials-Page 2