Datasheet
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
CD4053BM96 SOIC D 16 2500 330.0 16.8 6.5 10.3 2.1 8.0 16.0 Q1
CD4053BM96G3 SOIC D 16 2500 330.0 16.8 6.5 10.3 2.1 8.0 16.0 Q1
CD4053BM96G4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
CD4053BPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
CD4053BPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
CD4053BPWRG3 TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
CD4053BPWRG4 TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD4051BM96 SOIC D 16 2500 333.2 345.9 28.6
CD4051BM96 SOIC D 16 2500 367.0 367.0 38.0
CD4051BM96 SOIC D 16 2500 364.0 364.0 27.0
CD4051BM96G3 SOIC D 16 2500 364.0 364.0 27.0
CD4051BM96G4 SOIC D 16 2500 367.0 367.0 38.0
CD4051BM96G4 SOIC D 16 2500 333.2 345.9 28.6
CD4051BPWR TSSOP PW 16 2000 364.0 364.0 27.0
CD4051BPWR TSSOP PW 16 2000 367.0 367.0 35.0
CD4051BPWRG4 TSSOP PW 16 2000 367.0 367.0 35.0
CD4052BM96 SOIC D 16 2500 364.0 364.0 27.0
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Aug-2017
Pack Materials-Page 2