Datasheet

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TYPICAL APPLICATION
UDG−04096
+
PACK−
PACK+
HDQ
ESDProtection
D2
5.6V
R7
100 Ω
R8
100 Ω
R1
1kΩ
C1
0.1
µ
F
R2
1kΩ
R
S
0.02 Ω
R4
10kΩ
C2
0.1
µ
F
C3
0.1
µ
F
C4
0.1 µF
C3
0.1
µ
F
R3
1kΩ
Li-IonProtector
Li-Ion
or
Li-Pol
PGM TP
1
2
3
4
9
8
7
6
GPIO
SRP
SRN
BAT
RBI
VCC
VSS
D/C
bq27010DRK
5 HDQ
10PGM
11
ABSOLUTE MAXIMUM RATINGS
bq27010 , bq27210
SLUS707B – APRIL 2006 – REVISED JANUARY 2007
ORDERING INFORMATION
TA COMMUNICATION INTERFACE PACKAGED DEVICES
(1)
MARKINGS
HDQ bq27010DRKR 27010
-20 ° C to 70 ° C
I
2
C bq27210DRKR 27210
(1) The DRK package is available taped and reeled only. Quantities are 2,000 devices per reel.
over operating free-air temperature range (unless otherwise noted)
bq27010
UNITS
bq27210
V
CC
Supply voltage (with respect to V
SS
) –0.3 to 7
SRP, SRN, RBI, BAT (all with respect to –0.3 to
V
SS
) V
CC
+0.3
V
HDQ, SCL, SDA, GPIO (all with respect to
V
IN
Input voltage –0.3 to 7
V
SS
)
PGM (with respect to V
SS
) during EEPROM
–0.3 to 22
programming
I
SINK
Output sink current GPIO, SCL, SDA, HDQ 5 mA
T
A
Operating free-air temperature range –20 to 70
T
stg
Storage temperature range –65 to 150
° C
T
J
Operating junction temperature range –40 to 125
Lead temperature (soldering, 10 sec) 300
2
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