Datasheet

bq24090, bq24091
bq24092, bq24093
SLUS968A –JANUARY 2010–REVISED FEBRUARY 2010 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DESCRIPTION CONTINUED
The charger power stage and charge current sense functions are fully integrated. The charger function has high
accuracy current and voltage regulation loops, charge status display, and charge termination. The pre-charge
current and termination current threshold are programmed via an external resistor. The fast charge current value
is also programmable via an external resistor.
ORDERING INFORMATION
PART # V
O(REG)
V
OVP
JEITA TS/CE PG PACKAGE Marking
bq24090 4.20 V 6.6 V No 10kΩ NTC Yes 10 PIN 5x3mm
2
bq24090
bq24091 4.20 V 6.6 V No 100kΩ NTC Yes 10 PIN 5x3mm
2
bq24091
bq24092 4.20 V 6.6 V Yes 10kΩ NTC Yes 10 PIN 5x3mm
2
Product Preview
bq24093 4.20 V 6.6 V Yes 100kΩ NTC Yes 10 PIN 5x3mm
2
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
VALUE UNIT
IN (with respect to VSS) –0.3 to 7 V
OUT (with respect to VSS) –0.3 to 7 V
Input Voltage
PRE-TERM, ISET, ISET2, TS, CHG, PG, ASI, ASO (with respect to
–0.3 to 7 V
VSS)
Input Current IN 1.25 A
Output Current (Continuous) OUT 1.25 A
Output Sink Current CHG 15 mA
T
J
Junction temperature –40 to 150 °C
T
STG
Storage temperature –65 to 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground terminal unless otherwise noted.
PACKAGE DISSIPATION RATINGS
(1) (2)
PACKAGE R
qJA
R
qJC
T
A
≤ 25°C DERATING FACTOR
POWER RATING T
A
> 25°C
5x3mm MSOP 52°C/W 48°C/W 1.92 W 19.2 mW/°C
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
(2) This data is based on using the JEDEC High-K board and the exposed die pad is connected to a copper pad on the board. This is
connected to the ground plane by a 2×3 via matrix
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Product Folder Link(s): bq24090 bq24091