Datasheet

Table Of Contents

AFE031

www.ti.com

SBOS531D –AUGUST 2010–REVISED MAY 2012

For additional information on thermal PCB design using exposed thermal pad packages, refer to Application

Report SBOA130, Analog Front-End Design for a Narrowband Power-Line Communications Modem Using the

AFE031 and Application Report SLMA002E, PowerPAD™ Thermally-Enhanced Package (both available for

download at www.ti.com).

Powerline Communications Developer’s Kit

A PLC developer’s kit (TMDSPLCKIT-V3) is available to order at www.ti.com/plc. This kit offers complete

hardware and software solutions for introducing flexible, efficient, and reliable networking capabilities to a wide

variety of applications. With unique modular hardware architecture and flexible software framework, TI’s PLC

solutions are the only PLC-based technology capable of supporting multiple protocol standards and modulation

schemes with a single platform. This technology enables designers to leverage product lines across global

markets. The flexibility of the platform also allows developers to optimize hardware and software performance for

specific environmental operating conditions while simplifying end-to-end product design. Based on TI’s powerful

C2000™ microcontroller architecture and the AFE031, developers can select the correct blend of processing

capacity and peripherals to either add powerline communications to an existing design or implement a complete

application with PLC communications.

The C2000 Powerline Modem Developer's Kit enables easy development of software-based PLC modems. The

kit includes two PLC modems based on the C2000 TMS320F28069 controlCARD and the AFE031. The included

PLC SUITE software supports several communication techniques, including OFDM (PRIME/G3 and FlexOFDM)

and SFSK. The kit also includes onboard USB JTAG emulation and Code Composer Studio.

PACKAGING/MECHANICALS

Complete mechanical drawings and packaging information are appended to the end of this data sheet.

Product Folder Link(s): AFE031