Datasheet

PIN ASSIGNMENTS
REF+(REFIN)
NC
CONVST
EOC/ /CDIINT
RESERVED
+VA
+VBD
SCLK
1
2
3
4
12
11
10
9
REF-
16
FS/
CS
5
AGND
15
SDI
6
-IN
14
SDO
7
+IN
13
BDGND
8
REF+(REFIN)
NC
CONVST
EOC/ /CDIINT
+IN1
+VA
+VBD
SCLK
1
2
3
4
12
11
10
9
REF-
16
FS/CS
5
AGND
15
SDI
6
COM
14
SDO
7
+IN0
13
BDGND
8
+VBD
SCLK
BDGND
SDO
SDI
FS/CS
EOC/INT/CDI
CONVST
+VA
RESERVED
+IN
-IN
AGND
REF-
REF+(REFIN)
NC
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
+VBD
SCLK
BDGND
SDO
SDI
FS/CS
EOC/INT/CDI
CONVST
+VA
+IN1
+IN0
COM
AGND
REF-
REF+(REFIN)
NC
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
ADS7229
ADS7230
SBAS437A – MAY 2008 – REVISED JUNE 2009 ............................................................................................................................................................... www.ti.com
ADS7229
ADS7230
RSA PACKAGE (QFN)
RSA PACKAGE (QFN)
(TOP VIEW)
(TOP VIEW)
CAUTION: The thermal pad is internally connected to the substrate. This pad can be connected to the analog
ground or left floating. Keep the thermal pad separate from the digital ground, if possible.
ADS7229
ADS7230
PW PACKAGE (TSSOP)
PW PACKAGE (TSSOP)
(TOP VIEW)
(TOP VIEW)
NC = No internal connection
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Product Folder Link(s): ADS7229 ADS7230