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LE940B6

Hardware User Guide

1VV0301331 Rev. 1.8 - 2017-03-15

Summary of content (104 pages)

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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Notice While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or omissions.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Usage and Disclosure Restrictions License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by an express license agreement only and may be used only in accordance with the terms of such an agreement. Copyrighted Materials Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Contents 1. Introduction ..................................................................................................... 12 1.1. Scope ................................................................................................................ 12 1.2. Audience .......................................................................................................... 12 1.3. Contact Information, Support...................................
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 4.2. Recommended Operating Conditions ............................................................. 39 4.3. Logic Level Specifications................................................................................. 40 4.3.1. 1.8V Standard GPIOs ............................................................................ 40 4.3.2. 1.8V I2C Pads ........................................................................................ 41 4.3.3. 1.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 7.5. PCB Guidelines in case of FCC certification ..................................................... 65 7.5.1. Transmission line design....................................................................... 65 7.5.2. Transmission line measurements ......................................................... 66 8. Hardware Interfaces......................................................................................... 69 8.1. USB Port .........
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 10. Mounting the Module on your Board ............................................................... 85 10.1. General............................................................................................................. 85 10.2. Finishing & Dimensions.................................................................................... 85 10.3. Recommended Footprint for the Application .................................................
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 List of Tables Table 1: Applicability Table................................................................................................................. 2 Table 2: Related Documents ............................................................................................................ 14 Table 3: Document Structure ...........................................................................................................
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Table 40: EMC Recommendations ................................................................................................... 94 Table 41: Tray Packing ...................................................................................................................... 96 Table 42: Packing Quantities ............................................................................................................
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 List of Figures Figure 1: LE940B6 High-level Functionality ...................................................................................... 18 Figure 2: LGA Pads Layout LE940B6 334 Pads Top View .................................................................. 38 Figure 3: Power-on Circuit ................................................................................................................
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 1. Introduction 1.1. Scope This document introduces the Telit LE940B6 module and presents possible and recommended hardware solutions for developing a product based on the LE940B6 module. All the features and solutions detailed in this document are applicable to all LE940B6 variants, where “LE940B6” refers to the variants listed in the applicability table.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Alternatively, use: http://www.telit.com/en/products/technical-support-center/contact.php For detailed information about where you can buy the Telit modules or for recommendations on accessories and components, visit: http://www.telit.com To register for product news and announcements or for product questions contact Telit’s Technical Support Center (TTSC). Our aim is to make this guide as helpful as possible.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 1.5. Related Documents Table 2: Related Documents Document Title 1.6.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Term 1.7.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 2. General Product Description 2.1.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 2.3. General Functionality and Main Features The LE940B6 family of automotive cellular modules features an LTE and multi-RAT modem together with a powerful on-chip application processor and a rich set of interfaces. The major functions and features are listed below: • Multi-RAT with LTE carrier aggregation (Rel. 10, Cat.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 2.4. Environmental Requirements 2.4.1. Temperature Range Operating temperature range -20 ~ +55°C. This range is defined by 3GPP (the global standard for wireless mobile communication). Telit guarantees its modules to comply with all the 3GPP requirements and to have full functionality of the module with in this range. -40 ~ +85°C. Telit guarantees full functionality within this range as well.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 2.5. Operating Frequency Bands The operating frequencies in WCDMA and LTE modes conform to the 3GPP specifications. 2.5.1. RF Bands per Regional Variant Table 4 summarizes all region variants within the LE940B6 family, showing the supported band sets in each variant and the supported band pairs for 2x carrier aggregation.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 2.5.2. Reference Table of RF Bands Characteristics Table 5: RF Bands Characteristics Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels Tx-Rx Offset PCS 1900 1850.2 ~ 1909.8 1930.2 ~ 1989.8 512 ~ 810 80 MHz DCS 1800 1710.2 ~ 1784.8 1805.2 ~ 1879.8 512 ~ 885 95 MHz GSM 850 824.2 ~ 848.8 869.2 ~ 893.8 128 ~ 251 45 MHz EGSM 900 880.2 ~ 914.8 925.2 ~ 959.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Mode Freq. Tx (MHz) TDSCDMA 1900 – B39 1880 ~ 1920 LTE 2100 – B1 1920 ~ 1980 Freq.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Mode LTE 800 – B19 Freq. Tx (MHz) 830 ~ 845 Freq. Rx (MHz) 875 ~ 890 Channels Tx: 24000 ~ 24149 Tx-Rx Offset 45 MHz Rx: 6000 ~ 6149 LTE 800 – B20 832 ~ 862 791 ~ 821 Tx: 24150 ~ 24449 -41 MHz Rx: 6150 ~ 6449 LTE 1500 – B21 1447.9 ~ 1462.9 1495.9 ~ 1510.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 2.6. Sensitivity LE940B6 maximum sensitivity levels are as follows (exact performance figures will be specified at a later stage): • < 3GPP @ 2G • < 3GPP @ 3G • < 3GPP @ 4G FDD (BW=5 MHz) • < 3GPP @ 4G TDD (BW=5 MHz) Reproduction forbidden without written authorization by Telit Communications S.p.A.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 2.7. LE940B6 Mechanical Specifications 2.7.1. Dimensions The LE940B6 module’s overall dimensions are: 2.7.2. • Length: 40 mm, +/- 0.20 mm tolerance • Width: 40 mm, +/- 0.20 mm tolerance • Thickness: 3.0 mm, +/- 0.15 mm tolerance (with label) Weight The nominal weight of the LE940B6 module is 11 gram. Reproduction forbidden without written authorization by Telit Communications S.p.A.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 3. LE940B6 Module Connections 3.1. Pin-out Table 6: LE940B6 Pin-out PAD Signal A18 USB_VBUS D19 F19 USB_D+ USB_D- AH19 AF19 C103/TXD C104/RXD AA18 C105/RTS AK19 C106/CTS AG18 C107/DSR AC18 C108/DTR AE18 C109/DCD AJ18 C125/RING AB19 AD19 TXD_AUX RXD_AUX AM9 AM11 UART3_TXD UART3_RXD AM13 UART3_RTS AM15 UART3_CTS E4 F3 F5 G2 JTAG_TDI JTAG_RESOUT_N JTAG_TRIGOUT JTAG_RTCK I/O Function USB HS 2.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 X16 MAC_RXDV_ER I G10 G8 ETH_INT_N ETH_RST_N I O AD1 AU9 S1 ANT_1 ANT_DIV_1 ANT_GPS I/O I I F17 K17 AN8 VRTC VIO_1.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 3.2.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 3.3.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 4. Electrical Specifications 4.1. Absolute Maximum Ratings – Not Operational Caution: A deviation from the value ranges listed below may harm the LE940B6 module. Table 8: Absolute Maximum Ratings – Not Operational Symbol 4.2. Parameter Min Max Unit VBATT Battery supply voltage on pin VBATT -0.3 +6.0 [V] VBATT_PA Battery supply voltage on pin VBATT_PA -0.3 +6.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 4.3. Logic Level Specifications Unless otherwise specified, all the interface circuits of the LE940B6 are 1.8V CMOS logic. Only few specific interfaces (such as MAC, USIM and SD Card) are capable of dual voltage I/O. The following tables show the logic level specifications used in the LE940B6 interface circuits. The data specified in the tables below is valid throughout all drive strengths and the entire temperature ranges.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 4.3.2. 1.8V I2C Pads Table 12: Operating Range – 1.8V I2C Pads Parameter 4.3.3. Min Max Input high level 1.26V 2.3V Input low level -0.3V 0.54V Output high level --- --- Output low level --- 0.36V 1.2V EMIC Pads Table 13: Operating Range – 1.2V EMIC Pads Parameter Min Max Input high level 0.84V 1.4V Input low level -0.2V 0.24V Output high level 1.0V --- Output low level --- 0.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 4.3.4. 1.8V/2.9V SIM Pads Table 14: Operating Range – 1.8V SIM Pads Parameter Min Max Input high level 1.26V 2.1V Input low level -0.3V 0.36V Output high level 1.26V 2.1V Output low level -0.3V 0.36V Table 15: Operating Range – 2.9V SIM Pads Parameter 4.3.5. Min Max Input high level 2.03V 3.1V Input low level -0.3V 0.58V Output high level 2.03V 3.1V Output low level -0.3V 0.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 4.3.6. 2.5V/3.3V EMAC Interface for RMII and RGMII Table 17: Absolute Maximum Ratings – 3.3V EMAC Interface Parameter Input level on 3.3V EMAC when on Min -0.3V Max 3.6V Table 18: Operating Range – 2.5V EMAC Interface Parameter Min Max Input high level 1.7V 2.5V Input low level -0.3V 0.7V Output high level 2V --- Output low level --- 0.4V Table 19: Operating Range – 3.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 5. Hardware Commands 5.1. Turning on the LE940B6 Module To turn on the LE940B6 module, the ON_OFF_N pad must be asserted low in the range of 80 - 120 milliseconds and then released. Figure 3 illustrates a simple circuit to power on the module using an inverted buffer output. Figure 3: Power-on Circuit ON_OFF_N 80ms < Hold Time < 120ms R1 Q1 Power ON Impulse R2 GND NOTE: In case VBATT need to be removed and applied again.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Figure 4: LE940B6 Initialization and Activation NOTE: To check whether the LE940B6 has completely powered on, monitor the SW_RDY hardware line. When SW_RDY goes high, the module has completely powered on and is ready to accept AT commands. NOTE: Do not use any pull-up resistor on the ON_OFF_N line as it is internally pulled up.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Figure 5 shows a flow chart for the proper power-up procedure: Figure 5: Power-up Flow Chart Modem ON Procedure START N VBATT > 3.4V ? Y Y VAUX/PWRMON = ON? N ON_OFF_N = LOW Go to HW SHUTDOWN Unconditional 80 ms < Hold Time < 120 ms ON_OFF_N = HIGH VAUX/PWRMON = ON? N Y Delay = 25 sec Go to Start AT CMD Modem ON Procedure END Reproduction forbidden without written authorization by Telit Communications S.p.A.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Figure 6 shows a flow chart illustrating the AT commands managing procedure. Figure 6: AT Command Managing Flow Chart Start AT CMD START Delay 300 ms Enter AT AT Answer in 1 sec ? N Go to HW SHUTDOWN Undonditional Y Start AT CMD END Go to Modem ON Procedure Reproduction forbidden without written authorization by Telit Communications S.p.A.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 5.3.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Figure 7: Shutdown by Software Command VBATT AT#SHDN VAUX/PWRMON Monitoring Status Variable Above 6 sec Internal State Activation State Finalization State OFF State NOTE: To check whether the device has powered off, monitor the VAUX/PWRMON hardware line. When VAUX/PWRMON goes low, the device has powered off. Reproduction forbidden without written authorization by Telit Communications S.p.A.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 5.3.2. Hardware Shutdown To turn off the LE940B6 module, the ON_OFF_N pad must be asserted low in the range of 1150 1250 milliseconds and then released. Use the same circuitry and timing for power-on. When the ON_OFF_N is asserted low for a period in the range 1150 - 1250 milliseconds and then released, LE940B6 goes into the Finalization state and in the end shuts down VAUX/PWRMON.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 5.3.3. Unconditional Hardware Reset (RESET_N) To unconditionally restart the LE940B6 module, the RESET_N pad must be tied low in the range 1300 - 1800 milliseconds and then released. Figure 9 shows a simple circuit for this action.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 5.3.4. Unconditional Hardware Shutdown To unconditionally shut down the LE940B6 module, the SHDN_N pad must be tied low for at least 200 milliseconds and then released. Figure 10 shows a simple circuit for applying an unconditional shutdown.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Figure 11 shows a flow chart of the proper turn off procedure. Figure 11: Turn Off Procedure Modem OFF Procedure START VAUX/PWRMON = ON? N Y SW SHUTDOWN HW SHUTDOWN OFF Mode ON_OFF_N = LOW AT#SHDN Delay = 200 ms ON_OFF_N = HIGH N VAUX/PWRMON = ON? N Modem OFF Procedure END Y Looping for more 6 sec Y Go to Start AT CMD Reproduction forbidden without written authorization by Telit Communications S.p.A.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 6. Power Supply The power supply circuitry and board layout are very important parts of the full product design, with critical impact on the overall product performance. Read the following requirements and guidelines carefully to ensure a good and proper design. 6.1. Power Supply Requirements The LE940B6 power requirements are as follows: Table 20: Power Supply Requirements Nominal supply voltage 3.8V Supply voltage range 3.4V – 4.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Mode Average (Typ.) Mode Description 3.8 mA Paging cycle #128 frames (1.28 sec DRx cycle) 3.2 mA Paging cycle #256 frames (2.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Mode GSM 1800/1900 PL0 Average (Typ.) Mode Description 300 mA GPRS 4 Tx + 1 Rx GSM 850/900 PL5 750 mA GPRS Sending Data mode (CS-4) DCS 1800/1900 PL0 550 mA EGPRS 4 Tx + 1 Rx GSM 850/900 PL8 550 mA DCS 1800/1900 PL2 500 mA GPRS Sending Data mode (MCS-5) * Worst/best case current values depend on network configuration, not under module control. ** Applied MPR –2dB 16-QAM full RB *** 3.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 6.2. General Design Rules The principal guidelines for the Power Supply Design embrace three different design steps: 6.2.1. • Electrical design • Thermal design • PCB layout Electrical Design Guidelines The electrical design of the power supply depends strongly on the power source where this power is drained. Power sources can be distinguished by three categories: 6.2.1.1.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Figure 12: Example of Linear Regulator with 5V Input 6.2.1.2. + 12V Input Source Power Supply – Design Guidelines • The desired output for the power supply is 3.8V. Due to the big difference between the input source and the desired output, a linear regulator is unsuitable and must not be used. A switching power supply is preferable because of its better efficiency, especially with the 2A peak current load expected when working with the LE940B6.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Figure 13 and Figure 14 show an example of switching regulator with 12V input. Figure 13: Example of Switching Regulator with 12V Input – Part 1 Figure 14: Example of Switching Regulator with 12V Input – Part 2 Reproduction forbidden without written authorization by Telit Communications S.p.A.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 6.2.1.3. Battery Source Power Supply – Design Guidelines • The desired nominal output for the power supply is 3.8V, and the maximum allowed voltage is 4.2V. Hence, a single 3.7V Li-Ion cell battery type is suitable for supplying the power to the LE940B6 module. NOTE: Do not use any Ni-Cd, Ni-MH, and Pb battery types directly connected to the LE940B6 module. Their use can lead to overvoltage on the LE940B6 and damage it.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 6.2.2. Thermal Design Guidelines The thermal design for the power supply heat sink must be done with the following specifications: • Average current consumption during LTE 2xCA DL Max throughput @PWR level max in LE940B6: 1250 mA NOTE: The average consumption during transmission depends on the power level at which the device is requested to transmit via the network. Therefore, the average current consumption varies significantly.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 • The PCB traces to LE940B6 and the bypass capacitor must be wide enough to ensure that no significant voltage drops occur when the 2A current peaks are absorbed. This is needed for the same above-mentioned reasons. Try to keep these traces as short as possible.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 7. Antenna(s) Antenna connection and board layout design are the most important parts in the full product design, and they have a strong influence on the product’s overall performance. Read carefully and follow the requirements and guidelines for a good and proper design. 7.1.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 • If a ground plane is required in the line geometry, this plane must be continuous and sufficiently extended so the geometry can be as similar as possible to the related canonical model. • Keep, if possible, at least one layer of the PCB used only for the ground plane. If possible, use this layer as reference ground plane for the transmission line. • Surround the PCB transmission line with ground (on both sides).
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 7.3. 7.4. GSM/WCDMA/TD-SCDMA/LTE Antenna – Installation Guidelines • Install the antenna in a location with access to the network radio signal. • The antenna must be installed such that it provides a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. • The antenna must not be installed inside metal cases.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 The interface board is realized on a FR4, 4-layers PCB. Substrate material is characterized by relative permittivity εr = 4.6 ± 0.4 @ 1 GHz, TanD= 0.019 ÷ 0.026 @ 1 GHz. A characteristic impedance of nearly 50 Ω is achieved using trace width = 1.1 mm, clearance from coplanar ground plane = 0.3 mm each side. The line uses reference ground plane on layer 3, while copper is removed from layer 2 underneath the line.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Line input impedance (in Smith Chart format, once the line has been terminated to 50 Ω load) is shown in the following figure: Reproduction forbidden without written authorization by Telit Communications S.p.A.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Insertion Loss of G-CPW line plus SMA connector is shown below: Reproduction forbidden without written authorization by Telit Communications S.p.A.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 8. Hardware Interfaces Table 24 summarizes all the hardware interfaces of the LE940B6 module. Table 24: LE940B6 Hardware Interfaces LE940B6 (XMM7272 CAT6) Ethernet RMII/RGMII USB USB2.0 SPI Master only, up to 26 MHz (104 MHz @ Kernel CLK/4) I2C For sensors, audio control UART x1 UART for AT (up to 4.8 Mbps) x1 UART for diagnosis (up to 4.8 Mbps) x1 UART for GNSS or external controller (up to 4.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 8.1. USB Port The LE940B6 module includes a Universal Serial Bus (USB) transceiver, which operates at USB high-speed (480Mbits/sec). It can also operate with USB full-speed hosts (12Mbits/sec). It is compliant with the USB 2.0 specification and can be used for control and data transfers as well as for diagnostic monitoring and firmware update.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 NOTE: Even if USB communication is not used, it is still highly recommended to place an optional USB connector on the application board. At least test points of the USB signals are required since the USB physical communication is needed in the case of SW update. Warning: Consider placing low-capacitance ESD protection device to protect LE940B6 against ESD strikes.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 8.2.1. Modem Serial Port 1 Serial Port 1 is a +1.8V UART, having all the 8 RS232 signals. It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels. Table 26 lists the signals of LE940B6 Serial Port 1. Table 26: Modem Serial Port 1 Signals RS232 Pin # Signal Pad No.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 8.2.2. Modem Serial Port 2 On the LE940B6, Serial Port 2 is a +1.8V UART with Rx and Tx signals only. Table 27 lists the signals of the LE940B6 Serial Port 2. Table 27: Modem Serial Port 2 Signals PAD Signal I/O Function Type AB19 TXD_AUX O Auxiliary UART (Tx Data to DTE) 1.8V AD19 RXD_AUX I Auxiliary UART (Rx Data to DTE) 1.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 8.2.4. RS232 Level Translation To interface the LE940B6 with a PC COM port or an RS232 (EIA/TIA-232) application, a level translator is required. This level translator must perform the following actions: • Invert the electrical signal in both directions • Change the level from 0/1.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 As an example of RS232 level adaption circuitry could use a MAXIM transceiver (MAX218). In this case, the chipset is capable of translating directly from 1.8V to the RS232 levels (Example on 4 signals only). Figure 16: RS232 Level Adaption Circuitry Example NOTE: In this case, the length of the lines on the application must be taken into account to avoid problems in the case of High-speed rates on RS232.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 8.3. Peripheral Ports In addition to the LE940B6 serial ports, the LE940B6 supports the following peripheral ports: 8.3.1. • SPI – Serial Peripheral Interface • I2C - Inter-integrated circuit • Ethernet – Ethernet PHY Interface SPI – Serial Peripheral Interface The LE940B6 SPI supports the following: • Master Mode only • 1.8V CMOS level • Up to 26 MHz clock rate NOTE: SPI is supported only on the Linux side.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 8.3.2. I2C - Inter-integrated Circuit The LE940B6 I2C is an alternate function of GPIO 1-15 pins. Available only from Modem side as SW emulation of I2C on GPIO lines. Any GPIO can be configured as SCL or SDA. LE940B6 supports I2C Master Mode only. NOTE: SW emulated I2C on GPIO lines is supported only from the modem side. For more information, refer to Ref 1: LE940B6 AT Command Reference Guide for command settings. 8.4.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 PAD 8.5. Signal I/O Function Type AL16 MAC_RXD[0] I RGMII or RMII RXD[0] 2.5/3.3V AJ16 MAC_RXD[1] I RGMII or RMII RXD[1] 2.5/3.3V AG16 MAC_RXD[2] I RGMII RXD[2] 2.5/3.3V AE16 MAC_RXD[3] I RGMII RXD[3] 2.5/3.3V AC16 MAC_RX_CLK I RGMII Receive Clock 2.5/3.3V X16 MAC_RXDV_ER I RGMII Receive Data Available/Error or RMII Receive Error 2.5/3.3V G10 ETH_INT_N I Ethernet PHY Interrupt 2.5/3.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 8.5.2. Digital Audio The LE940B6 module can be connected to an external codec through the digital interface. The product provides a single Digital Audio Interface (DVI) on the following pins: Table 32: Digital Audio Interface (DVI) Signals 8.6. PAD Signal I/O Function Type Comments D11 DVI_WA0 O Digital Audio Interface (WA0) B-PD 1.8V PCM_SYNC C8 DVI_RX I Digital Audio Interface (RX) B-PD 1.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 PAD Signal I/O Function Type Drive Strength R18 GPIO_07 I/O Configurable GPIO CMOS 1.8V 3 mA S19 GPIO_08 I/O Configurable GPIO CMOS 1.8V 3 mA U19 GPIO_09 I/O Configurable GPIO CMOS 1.8V 3 mA W19 GPIO_10 I/O Configurable GPIO CMOS 1.8V 3 mA L18 GPIO_11 I/O Configurable GPIO CMOS 1.8V 3 mA J18 GPIO_12 I/O Configurable GPIO CMOS 1.8V 3 mA AN4 GPIO_20 I/O Configurable GPIO CMOS 1.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Figure 19: GPIO Output Pad Equivalent Circuit Reproduction forbidden without written authorization by Telit Communications S.p.A.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 9. Miscellaneous Functions 9.1. Indication of Network Service Availability The STAT_LED pin status shows information on the network service availability and call status. In the LE940B6 module, the STAT_LED usually needs an external transistor to drive an external LED. The status indicated in Table 34 is configurable. Refer to Ref 1: LE940B6 AT Command Reference Guide for the full description of this function.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 9.2. RTC – Real Time Clock The VRTC pin is used to power the RTC only when the main battery voltage level is too low or missing. 9.3. VAUX Power Output A regulated power supply output is provided to supply small devices from the module. This output is active when the module is ON and goes OFF when the module is shut down.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 9.5. Using the Temperature Monitor Function The Temperature Monitor supports temperature monitoring by giving periodic temperature indications, to execute some function at extreme state. If properly set (see the #TEMPMON command in the Ref 1: LE940B6 AT Command Reference Guide), it raises a GPIO to High Logic level when the maximum temperature is reached. 9.6.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 10. Mounting the Module on your Board 10.1. General The LE940B6 module is designed to be compliant with a standard lead-free soldering process as defined in JESD22b102d, table 3b. The number of reflows must not exceed two. This limits Tmax to 245 °C. 10.2. Finishing & Dimensions Reproduction forbidden without written authorization by Telit Communications S.p.A.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 10.3. Recommended Footprint for the Application Figure 22 shows the top view of the module, which has 334 pads (dimensions are in mm). To facilitate replacing the LE940B6 module if necessary, it is suggested to design the application board with a 1.5 mm placement inhibit area around the module. These regions are highlighted in Figure 22.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 10.4. Stencil Stencil’s apertures layout can be the same as the recommended footprint (1:1). The suggested thickness of stencil foil is greater than 120 µm. 10.5. PCB Pad Design The solder pads on the PCB are recommended to be of the Non Solder Mask Defined (NSMD) type. Figure 23: PCB Pad Design Reproduction forbidden without written authorization by Telit Communications S.p.A.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 10.6. Recommendations for PCB Pad Dimensions (mm) Figure 24: PCB Pad Dimensions It is not recommended to place around the pads a via or micro-via that is not covered by solder resist in an area of 0.3 mm unless it carries the same signal as the pad itself (see Figure 25). Figure 25: Inhibit Area for Micro-via Holes in pad are allowed only for blind holes and not for through holes.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 The PCB must be able to resist the higher temperatures, which occur during the lead-free process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-lead solder paste on the described surface plating is better compared to lead-free solder paste. 10.7. Solder Paste We recommend using only “no clean” solder paste to avoid the cleaning of the modules after assembly. 10.7.1.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 11. Application Guide 11.1.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 11.2. Bypass Capacitor on Power Supplies When a sudden voltage step is asserted to or a cut from the power supplies, the steep transition causes some reactions such as overshoot and undershoot. This abrupt voltage transition can affect the device causing it to not operate or to malfunction. Bypass capacitors are needed to alleviate this behavior. The behavior can appear differently depending on the various applications.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 11.3. SIM Interface This section presents the recommended schematics for the design of SIM interfaces on the application boards. The LE940B6 supports two external SIM interfaces. 11.3.1. SIM Schematic Example Figure 27 illustrates in particular how to design the application side, and what values the components should have. Figure 27: SIM Schematics NOTE: An external pull-up resistor on SIMIO is not required.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 11.4. EMC Recommendations All LE940B6 signals are provided with some EMC protection. Nevertheless, the accepted level differs according to the specific pin. Table 40 lists the characteristics.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 11.6. Antenna Detection The LE940B6 module provides an antenna detection application. Many automotive applications require to detect if the antenna is shorted to ground or the battery of the vehicle for fault tracing. Basically, antenna detection is performed by means of its DC characteristics, splitting the DC and RF paths. Refer to Telit 80000NT10002a - Antenna Detection Application Note.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 12. Packing System The LE940B6 module is packed on trays. The tray is JEDEC compliant, injection molded antistatic Modified Polyphenylene ether (MPPO). It has good thermal characteristics and can withstand the standard baking temperature of up to 125°C, thereby avoiding the need of handling the modules if baking is required. The trays are rigid, thus providing mechanical protection against transport stress.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Each tray contains 24 modules as shown in Figure 28. Figure 28: Tray Packing Reproduction forbidden without written authorization by Telit Communications S.p.A.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 12.1. Tray Drawing The Telit LE940B6 is packaged on trays. Each tray contains 21 pieces with the following dimensions: Figure 29: Tray Drawing Warning: These trays can withstand a maximum temperature of 125°C 12.2. Moisture Sensitivity The LE940B6 module is a Moisture Sensitive Device Level 3, in accordance with standard IPC/JEDEC J-STD-020. Observe all of the requirements for using this kind of components.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 13. Conformity Assessment Issues 13.1. FCC/IC Regulatory Notices Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be colocated or operating in conjunction with any other antenna or transmitter.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 14. Safety Recommendations READ CAREFULLY Be sure that the use of this product is allowed in your country and in the environment required. The use of this product may be dangerous and must be avoided in the following areas: • Where it can interfere with other electronic devices in environments such as hospitals, airports, aircrafts, etc. • Where there is risk of explosion, such as gasoline stations, oil refineries, etc.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 15. Document History Table 43: Document Revision History Revision Rev. 1.8 Date 2017-03-10 Changes Sec. 5.1: Added Note Sec. 5.3: Added Note Sec. 6.1: Updated table 21 LE940B6 Current Consumption Sec. 7.5: Added new sub chapter Sec. 13: Added Conformity Assessment Issues Rev. 1.7 2017-01-25 Sec. 5: Figures and charts revised Sec.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Revision v. 1.6 Date 2016-11-15 Changes Official Release Sec. 2.7: Updated the Mechanical Specifications Sec. 3.1: Added VPP pin for eFuse Sections 3.1, 3.3, 4.3.6, 8: SD / MMC interfaces were deleted - they are not supported by the chipset vendor. Sec. 5: Updated the specifications and charts of Hardware Commands (Boot-up/Shutdown time, On/Shutdown key hold time) Sec. 5.1: Updated the Power on Hold time. Sec. 5.3.
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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Revision Rev. 1.5 Date 2016-09-20 Changes (Interim version) Page 2, Table 1: Updated the Applicability table Sec. 2: Updated the General Product Description Sec. 2.5.1, 2.5.2: Updated the RF bands tables Sec. 3.1: Updated the pin description in the Pin-out table Sec. 4.3: Added tables of logic level specifications Sec. 5: Updated the Turning On and Off trigger times, figures and flow charts Sec. 6.