Information

HE 13 / HE 14 - 2.54mm Centreline Interconnection System
41
Specifications subject to change.Dimensions are shown in mm
for reference purposes only.
Catalogue No. 1773393
November 2006
www.tycoelectronics.com
Product Facts
A multi-contact connector range designed to reliably meet todays interconnection requirements for signal transmission in a variety of computer,
telecommunications and industrial applications.
Complying fully with the CEI IEC 603-8 international standard, this wire-to-board interconnection system is composed of IDC receptacle assemblies for discrete
wires or ribbon cable, receptacle housings for crimp snap-in receptacle contacts, and vertical or right-angle shrouded and polarised board-mount headers.
All products are available with a choice of gold (HE 13) or tin (HE 14) plating finishes.
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Receptacle assemblies preloaded with Insulation Displacement
Contacts (IDC) to terminate discrete wires or 2.54mm centreline
ribbon cable
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Receptacle housings accept crimp snap-in contacts to terminate
discrete wires
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Headers provided for straight or right-angle mounting to be soldered
onto 1.6mm printed circuit boards
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Protective header shrouds feature an integrated detent latching device
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Compliant to the CEI IEC 603-8 International Standard
Specification:
Current Rating - 3 A max at 20°C
Contact Resistance - 20 mΩ max (HE 13)
- 30 mΩ max (HE 14)
Dielectric Withstanding Voltage - 1000 V rms (HE 13)
- 500 V rms (HE 14)
Insulation Resistance - 5000 MΩ (HE 13)
- 1000 MΩ (HE 14)
Operating Temperature - -55°C to +125°C (HE 13)
- -40°C to +100°C (HE 14)
Durability - 400 cycles (HE 13)
- 30 cycles (HE 14)
Insertion/Withdrawal Force - 1.5 N max per contact + latching force (HE 13)
- 3 N max per contact + latching force (HE 14)