Datasheet

ST6200C/ST6201C/ST6203C
89/100
11.3 SOLDERING AND GLUEABILITY INFORMATION
Recommended soldering information given only
as design guidelines in Figure 72 and Figure 73.
Recommended glue for SMD plastic packages:
■ Heraeus: PD945, PD955
■ Loctite: 3615, 3298
Figure 72. Recommended Wave Soldering Profile (with 37% Sn and 63% Pb)
Figure 73. Recommended Reflow Soldering Oven Profile (MID JEDEC)
250
200
150
100
50
0
40 80
120 160
Time [sec]
Temp. [°C]
20 60
100 140
5 sec
COOLING PHASE
(ROOM TEMPERATURE)
PREHEATING
80°C
PHASE
SOLDERING
PHASE
250
200
150
100
50
0
100 200
300 400
Time [sec]
Temp. [°C]
ramp up
2°C/sec for 50sec
90 sec at 125°C
150 sec above 183°C
ramp down natural
2°C/sec max
Tmax=220+/-5°C
for 25 sec
1