Datasheet

Model Selection
Condition & Description
of improvement
Initial adsorption problem
(During trial operation)
Contributing factor Countermeasure
Late vacuum achieving
time (Shortening of
response time)
 Countermeasures for Vacuum Adsorption System Problems (Troubleshooting)
Adsorption area is small.
(Lifting force is lower than the
workpiece mass.)
Reconfirm the relationship between workpiece mass and lifting force.
• Use a vacuum pad with a large adsorption area.
• Increase the quantity of vacuum pads.
Vacuum pressure is low.
(Leakage from adsorption surface)
(Air permeable workpiece)
Eliminate (reduce) leakage from adsorption surface.
• Reconsider shape of vacuum pad.
Confirm the relationship between suction flow rate and arrival
pressure of vacuum ejector.
• Use a vacuum ejector with a high suction flow rate.
• Increase adsorption area.
Vacuum pressure is low.
(Leakage from vacuum piping)
Repair leakage point.
Internal volume of vacuum circuit
is large.
Confirm the relationship between internal volume of the vacuum
circuit and suction flow rate of the vacuum ejector.
• Reduce internal volume of the vacuum circuit.
• Use a vacuum ejector with a high suction flow rate.
Pressure drop of vacuum piping is
large.
Reconsider vacuum piping.
• Use a shorter or larger tube (with appropriate diameter).
Inadequate supply pressure of
vacuum ejector
Measure supply pressure in vacuum generation state.
• Use standard supply pressure.
• Reconsider compressed air circuit (line).
Clogging of nozzle or diffuser
(Infiltration of foreign objects
during piping)
Remove foreign objects.
Supply valve (switching valve) is
not being activated.
Measure supply voltage at the solenoid valve with a tester.
• Review electric circuits, wiring and connectors.
• Use in the rated voltage range.
Workpiece deforms during
adsorption.
Since a workpiece is thin, it deforms and leakage occurs.
• Use a pad for adsorption of thin objects.
Internal volume of vacuum circuit
is large.
Confirm the relationship between internal volume of the vacuum
circuit and suction flow rate of the vacuum ejector.
• Reduce internal volume of the vacuum circuit.
• Use a vacuum ejector with a high suction flow rate.
Pressure drop of vacuum piping is
large.
Reconsider vacuum piping.
• Use a shorter or larger tube (with appropriate diameter).
Using the product as close to the
highest vacuum power in the
specifications.
Set vacuum pressure to minimum necessary value by optimizing
the pad diameter, etc.
As the vacuum power of an ejector (venturi) rises, the vacuum
flow actually lowers. When an ejector is used at its highest
possible vacuum value, the vacuum flow will lower. Due to this,
the amount of time needed to achieve adsorption is lengthened.
One should consider an increase in the diameter of the ejector
nozzle or an increase the size of the vacuum pad utilised in order
to lower the required vacuum pressure, maximum the vacuum
flow, and speed up the adsorption process.
Setting of vacuum pressure switch
is too high.
Set to suitable setting pressure.
Front matter 27