AirPrime and HL7588 Product Technical Specification Rev9 0

4116369 Rev 9.0 September 04, 2017 7
Contents
1. INTRODUCTION ................................................................................................ 12
1.1. Common Flexible Form Factor (CF
3
) ................................................................................ 12
1.2. Physical Dimensions ......................................................................................................... 13
1.3. General Features ............................................................................................................... 13
1.4. Architecture........................................................................................................................ 15
1.5. Interfaces ........................................................................................................................... 16
1.6. Connection Interface ......................................................................................................... 16
1.7. ESD ................................................................................................................................... 17
1.8. Environmental and Certifications ....................................................................................... 17
1.8.1. Environmental Specifications ................................................................................... 17
1.8.2. Regulatory ................................................................................................................ 18
1.8.3. RoHS Directive Compliant ....................................................................................... 18
1.8.4. Disposing of the Product .......................................................................................... 18
1.9. References ........................................................................................................................ 18
2. PAD DEFINITION ............................................................................................... 19
2.1. Pad Configuration (Top View, Through Module) ............................................................... 24
3. DETAILED INTERFACE SPECIFICATIONS ..................................................... 25
3.1. Power Supply..................................................................................................................... 25
3.2. Current Consumption ........................................................................................................ 25
3.3. VGPIO ............................................................................................................................... 26
3.4. BAT_RTC .......................................................................................................................... 27
3.5. SIM Interface ..................................................................................................................... 27
3.5.1. UIM1_DET ............................................................................................................... 28
3.6. USB ................................................................................................................................... 28
3.7. Electrical Information for Digital I/O ................................................................................... 29
3.8. General Purpose Input/Output (GPIO) .............................................................................. 29
3.9. Main Serial Link (UART1) .................................................................................................. 30
3.10. POWER-ON Signal (PWR_ON_N).................................................................................... 31
3.11. Reset Signal (RESET_IN_N) ............................................................................................. 31
3.12. Analog to Digital Converter (ADC1) .................................................................................. 32
3.13. Clock Interface ................................................................................................................... 32
3.14. PCM ................................................................................................................................... 33
3.15. Debug Interfaces ............................................................................................................... 34
3.15.1. Trace Debug ............................................................................................................ 34
3.15.2. JTAG ........................................................................................................................ 35
3.16. RF Interface ....................................................................................................................... 35
3.16.1. RF Connection ......................................................................................................... 35