User's Manual

page 42/64
Note d’étude / Technical document : URD1– OTL
5665.3 – 003 / 72238 Edition 01
Document Sagemcom Reproduction et divulgation interdites
Sagemcom document. Reproduction and disclosure prohibited
5. RECOMMENDED I/OS AND COMPONENTS ON THE FINAL PRODUCT
The design of the customer’s board (on which the module is soldered) must provide an access to following
signals when the final product will be completely integrated.
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To upgrade the module software, SAGEMCOM recommends providing a direct access to the module
serial link through an external connector or any mechanism allowing the upgrade of the module without
opening the whole product.
Serial link:
TXD Output UART transmit
RXD Input UART receive
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To trace the module software, SAGEMCOM recommends providing a direct access to the module trace
port UART0 (2 I/Os) through internal test points (TP) located on the customer's main board.
The board has to feature as minimum those external components.
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A capacitor of 47µF on the VBAT near pads 30 and 31.
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A capacitor of 10µF on VBACKUP when no backup battery is used.
6. ESD & EMC RECOMMENDATIONS
6.1 HILONC V2 ALONE
The HiLoNC V2 module alone can hold up to 2KV on each of the 51 pads including the RF pad.
6.2 HANDLING THE MODULE
HiLoNC V2 modules are designed and packaged in tape-and-real for factories SMT process.
HiLoNC V2 modules contain electronic circuits sensitive to human hand's electrostatic electricity.
Handling without ESD protection could result in permanent damages or even destruction of the module.
6.3 Customer’s product with HiLONC V2
If customer’s design must stand more than 2kV on electrostatic discharge, following recommendation must be
followed.
6.4 Analysis
ESD current can penetrate inside the device via the typical following components:
• SIM connector
• Microphone
• Speaker
• Battery / data connector
• All pieces with conductive paint.
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In order to avoid ESD issues, efforts shall be done to decrease the level of ESD current on electronic
components located inside the device (customer’s board, input of the HiLoNC V2 module, etc…)