User Manual

W27E010
- 14 -
Package Dimensions, Continued
32-Lead PLCC
L
c
1
b
2
A
H
E
E
e
b
D
H
D
y
A
A
1
Seating Plane
E
G
G
D
1
13
14 20
29
32
4
5
21
30
Notes:
1. Dimensions D & E do not include interlead flash.
2. Dimension b does not include dambar protrusion/intrusion.
3. Controlling dimension: Inches.
4. General appearance spec. should be based on
final
visual inspection sepc.
θ
Symbol
Min. Nom. Max. Max.Nom.Min.
Dimension in Inches
Dimension in mm
A
b
c
D
e
HE
L
y
A
A
1
2
E
b
1
G
D
3.56
0.50
H
D
G E
0.020
0.140
2.802.67 2.93
0.71
0.66 0.81
0.41
0.46
0.56
0.20
0.25
0.35
13.89
13.97
14.05
11.35
11.43
11.51
1.27
12.45 12.95 13.460.530
0.510
0.490
0.050
0.453
0.450
0.447
0.553
0.550
0.547
0.014
0.010
0.008
0.022
0.018
0.016
0.0320.026
0.028
0.1150.105 0.110
1.12 1.420.044 0.056
0
°
10
°
10
°
0
°
9.91
10.41
10.92
14.86
14.99
15.11
12.32
12.45
12.57
1.91 2.29
0.004
0.095
0.090
0.075
0.495
0.490
0.485
0.595
0.590
0.585
0.430
0.410
0.390
0.10
2.41
θ
Headquarters
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: [phone]
FAX: [phone]
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-7197006
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: [phone]
FAX: [phone]
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II,
123 Hoi Bun Rd., Kwun Tong,
Kowloon, Hong Kong
TEL: [phone]
FAX: [phone]
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2730 Orchard Parkway, San Jose,
CA 95134, U.S.A.
TEL: [phone]
FAX: [phone]
Note: All data and specifications are subject to change without notice.