Product Info

LTE Standard Module Series
EG91 Series Hardware Design
EG91_Series_Hardware_Design
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Table 49: Recommended Thermal Profile Parameters
Factor Recommendation
Soak Zone
Max slope 1–3 °C/s
Soak time (between A and B: 150 °C and 200 °C) 70–120 s
Reflow Zone
Max slope 2–3 °C/s
Reflow time (D: over 220°C) 45–70 s
Max temperature 238 °C to 246 °C
Cooling down slope -1.5 to -3 °C/s
Reflow Cycle
Max reflow cycle 1
8.3. Packaging
EG91 series module is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be
opened until the devices are ready to be soldered onto the application.
The reel is 330mm in diameter and each reel contains 250 modules. The following figures show the
packaging details, measured in mm.