Product Info

LTE Standard Module Series
EG91 Series Hardware Design
EG91_Series_Hardware_Design
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8 Storage, Manufacturing and
Packaging
8.1. Storage
The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage
requirements are shown below.
1. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity
should be 35%–60%.
2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition.
3. The floor life of the module is 168 hours
1)
in a plant where the temperature is 23 ±5 °C and relative
humidity is below 60%. After the vacuum-sealed packaging is removed, the module must be
processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the
module should be stored in an environment where the relative humidity is less than 10% (e.g. a drying
cabinet).
4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under
the following circumstances:
• The module is not stored in Recommended Storage Condition;
• Violation of the third requirement above occurs;
• Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
• Before module repairing.
5. If needed, the pre-baking should follow the requirements below:
• The module should be baked for 8 hours at 120 ±5 °C;
• All modules must be soldered to PCB within 24 hours after the baking, otherwise they should be
put in a dry environment such as in a drying oven.