Product Info

LTE Standard Module Series
EG91 Series Hardware Design
EG91_Series_Hardware_Design
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Figure 42: Module Bottom Dimensions (Top View) .................................................................................... 87
Figure 43: Recommended Footprint (Top View) ......................................................................................... 88
Figure 44: Top View of the Module ............................................................................................................. 89
Figure 45: Bottom View of the Module ....................................................................................................... 89
Figure 46: Recommended Reflow Soldering Thermal Profile .................................................................... 91
Figure 47: Tape Dimensions ....................................................................................................................... 93
Figure 48: Reel Dimensions ....................................................................................................................... 93
Figure 49: Tape and Reel Directions .......................................................................................................... 94