Datasheet

PBSS8110X_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 11 December 2009 12 of 15
NXP Semiconductors
PBSS8110X
100 V, 1 A NPN low V
CEsat
(BISS) transistor
11. Soldering
12. Mounting
Reflow soldering is the only recommended soldering method
Fig 19. Reflow soldering footprint SOT89 (SC-62/TO-243)
msa442
1.00
(3x)
4.85
4.60
1.20
4.75
0.60 (3x)
0.70 (3x)
3.70
3.95
1.20
0.50
1.70
132
0.20
0.85
1.20
1.20
1.90
2.00
2.25
solder lands
solder resist
occupied area
solder paste
Dimensions in mm
Fig 20. FR4 PCB, standard footprint Fig 21. FR4 PCB, mounting pad for
collector 6cm
2
001aaa234
2.5 mm
5 mm
1.6 mm
0.5 mm
1 mm
3.96 mm
3 mm
2.5 mm
1 mm
40
mm
32 mm
001aaa235
2.5 mm
5 mm
1.6 mm
0.5 mm
1 mm
3.96 mm
30 mm
20
mm
40
mm
32 mm