Datasheet

PBSS4032NZ_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 01 — 31 March 2010 11 of 15
NXP Semiconductors
PBSS4032NZ
30 V, 4.9 A NPN low V
CEsat
(BISS) transistor
11. Soldering
Fig 16. Reflow soldering footprint SOT223 (SC-73)
Fig 17. Wave soldering footprint SOT223 (SC-73)
sot223_
fr
1.2
(4×)
1.2
(3×)
1.3
(4×)
1.3
(3×)
6.15
7
3.85
3.6
3.5
0.3
3.9 7.65
2.3 2.3
6.1
4
231
solder lands
solder resist
occupied area
solder paste
Dimensions in mm
sot223_
fw
1.9
6.7
8.9
8.7
1.9
(3×)
1.9
(2×)
1.1
6.2
2.7 2.7
2
4
31
solder lands
solder resist
occupied area
preferred transport
direction during soldering
Dimensions in mm