Datasheet

BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 24 October 2011 7 of 22
NXP Semiconductors
BCP55; BCX55; BC55PA
60 V, 1 A NPN medium power transistors
FR4 PCB, standard footprint
Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223;
typical values
FR4 PCB, mounting pad for collector 1 cm
2
Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223;
typical values
006aac677
10
1
10
2
10
3
Z
th(j-a)
(K/W)
10
–1
10
–5
1010
–2
10
–4
10
2
10
–1
t
p
(s)
10
–3
10
3
1
0
duty cycle = 1
0.01
0.02
0.05
0.1
0.2
0.33
0.5
0.75
006aac678
10
1
10
2
10
3
Z
th(j-a)
(K/W)
10
–1
10
–5
1010
–2
10
–4
10
2
10
–1
t
p
(s)
10
–3
10
3
1
0
duty cycle = 1
0.01
0.02
0.05
0.1
0.2
0.33
0.5
0.75