Datasheet

BCP53_BCX53_BC53PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 9 — 19 October 2011 17 of 22
NXP Semiconductors
BCP53; BCX53; BC53PA
80 V, 1 A PNP medium power transistors
Fig 24. Reflow soldering footprint SOT89 (SC-62/TO-243)
Fig 25. Wave soldering footprint SOT89 (SC-62/TO-243)
solder lands
solder resist
occupied area
solder paste
sot089_fr
1.2
1.9
2
2.25
4.75
1
(3×)
0.7
(3×)
0.6
(3×)
1.1
(2×)
1.2
0.85
0.2
0.5
1.7
4.85
3.95
4.6
1.51.5
Dimensions in mm
solder lands
solder resist
occupied area
preferred transport direction during soldering
sot089_fw
0.7
5.3
6.6
2.4
3.5
0.5
1.8
(2×)
1.5
(2×)
7.6
1.9 1.9
Dimensions in mm