Datasheet
54
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
®
NPI Power Inductors
NPI__C Series
Series A B C G (Ref) H (Ref) I (Ref)
NPI32C 3.50 ± 0.3 3.00 ± 0.3 2.10 ± 0.3 1.1 3.3 1.30
NPI43C 4.50 ± 0.3 4.00 ± 0.3 3.20 ± 0.3 1.5 4.5 1.75
NPI52C 5.80 ± 0.3 5.20 ± 0.3 2.00 ± 0.3 1.7 5.5 2.15
NPI54C 5.80 ± 0.3 5.20 ± 0.3 4.50 ± 0.3 1.7 5.5 2.15
NPI73C 7.80 ± 0.3 7.00 ± 0.3 3.50 ± 0.5 2.0 7.5 3.0
NPI75C 7.80 ± 0.3 7.00 ± 0.3 5.00 ± 0.5 2.0 7.5 3.0
NPI104C 10.0 ± 0.3 9.00 ± 0.3 4.00 ± 0.5 2.5 9.5 3.75
NPI105C 10.0 ± 0.4 9.00 ± 0.4 5.40 ± 0.4 2.5 9.5 3.75
A
B
150
G
I
H
I
REFLOW SOLDERING
LAND PATTERN
DIMENSIONS (mm)
FEATURES
• HIGH CURRENT, SMALL SIZE (UP TO 4 AMPS)
• SURFACE MOUNTABLE CONSTRUCTION
• HIGH INDUCTANCE (UP TO 820µH)
• TAPED AND REELED FOR AUTOMATIC INSERTION
• FOR USE IN DC/DC CONVERTERS, DC/AC INVERTERS
• Pb-FREE COMPATIBLE
CHARACTERISTICS
Case Size NPI32C NPI43C NPI52C NPI54C NPI73C NPI75C NPI104C NPI105C
Inductance Range
1 ~ 470µH 1 ~ 680µH 1 ~ 560µH 1 ~ 680µH 10 ~ 330µH 10 ~ 470µH 10 ~ 560µH 10 ~ 820µH
Inductance Tolerance 10% (K), 20% (M)
Ambient Operating
Temperature Range
-40°C ~ +85°C*
Maximum Component
Temperature
(Ambient + Self-Heating)
+125°C*
Inductance Change at Isat -30% max.
Temperature Raise at Irms +40°C max.
Resistance to Solder Heat 260°C for 10 seconds
C
REFLOW SOLDERING PROFILE
Soldering 260°C max.
5 seconds max.
Cool Down
60 ~ 120 sec.
25
50
100
150
200
250
300
Pre-Heat
150°C ~ 180°C
Time above 230°C
30 seconds max.
30 60 90
120 150
180 210
240 270
300
Time - Seconds
Temperature °C
NPI
43 C
4R7
M
TR
F
RoHS Compliant
Packaging: TR = Tape & Reel
Inductance Tolerance Code: M=±20%
Inductance Code (µH): 1st two digits are signicant,
3rd digit is multiplier for values from 10µH and up.
Construction Code (see drawing for details)
Size Code (see table for details)
Series
PART NUMBER SYSTEM
*See Part Number System for Details
RoHS
Compliant
includes all homogeneous materials
Termination Plating
Sn 96.5% - Ag 3.0% - Cu 0.5%
*Specications reect recent product changes. For more information refer to PCN announcement [Link]