Datasheet
2
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
®
Specications are subject to change
Molded Chip Wirewound Inductors
NIN Series
Applicable Guidelines:
1. Recommended soldering conditions :
Flow (wave): 250
o
C for 5 sec. max. (preheating of 120
o
C for 5 minutes.)
Reow: 250
o
C for 10 sec. max., total time above 230°C is 40 sec. max. (preheating 150°C ~ 180°C/120 sec. max.)
2. Avoid placing inductor over any metal pattern on the PCB, which may create mutual inductance problems.
3. For mounting, it is suggested to secure chip inductor by means of epoxy adhesive curable by ultraviolet.
4. Ultrasonic cleaning is not recommended. If it is necessary, the cleaning conditions must be examined so as not to create mechanical
damage by unexpected resonant vibration. Please contact our engineering department.
5. An excessive mechanical force may effect the electrical and magnetic properties of chip inductors. Make sure not to use any stress
greater than 2Kg when component is placed.
ENVIRONMENTAL CHARACTERISTICS
Test Specication Test Method & Condition
Solderability 90% Min. Coverage After 3 Sec. Dip in +230°C Solder Pot (Post Flux)
Humidity
(1) No Evidence of Damage
(2) Inductance Shall Be Within
±5% of Initial Value
(3) Q Factor Shall Be Within
±10% of Initial Value
After 500 Hrs at +60°C and 90~95% RH
Soldering Effect After 5 Sec. at +260°C (5 min. 120°C Pre-Heat)
Low Frequency Vibration After 2 Hrs per Axis, 10 ~ 55Hz, 1.5mm Amplitude
Thermal Shock After 100 Cycles (-40°C ~ +85°C) 30 Min. Each
Low Temperature Storage After 500 Hrs at -25°C
High Temperature Load
Life
(1) No Evidence of Damage
(2) Inductance Shall Be Within
±10% of Initial Value
(3) Q Factor Shall Be Within
±10% of Initial Value
After 500 Hrs. at +85°C with Rated DC Current
Humidity Load Life
After 500 Hrs at +60°C with 90~95% RH
at Rated DC Current