© 2009 Microchip Technology Inc. DS22121B-page 45
MCP23009/MCP23S09
APPENDIX A: REVISION HISTORY
Revision B (May 2009)
The following is the list of modifications:
1. Added the 3x3 QFN package (MG package
marking).
2. Updated Revision History.
Revision A (December 2008)
• Original Release of this Document.
