Datasheet

MAX7306/MAX7307
SMBus/I
2
C Interfaced 4-Port, Level-Translating
GPIOs and LED Drivers
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS (MAX7306)
(V
DD
= 1.62V to 3.6V, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at V
DD
= 3.3V, T
A
= +25°C.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to GND.)
V
DD
..........................................................................-0.3V to +4V
V
LA
, SCL, SDA, AD0, and RST.................................-0.3V to +6V
P1/INT, P2/OSCIN, P3/OSCOUT, and P4
MAX7306................................................-0.3V to (V
DD
+ 0.3V)
MAX7307.................................................-0.3V to (V
LA
+ 0.3V)
P1/INT, P2/OSCIN, P3/OSCOUT, and P4 Sink Current ......25mA
P2/OSCIN, P3/OSCOUT, and P4 Source Current ..............10mA
SDA Sink Current ...............................................................10mA
V
DD
Current .......................................................................10mA
V
LA
Current (MAX7307) ......................................................30mA
GND Current ....................................................................100mA
Continuous Power Dissipation (T
A
= +70°C)
10-Pin µDFN (derate 5.0mW/°C over +70°C) ..............402mW
10-Pin µMAX (derate 10.3mW/°C over +70°C) ............825mW
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER
SYMBOL
CONDITIONS MIN TYP
MAX
UNITS
Operating Supply Voltage V
DD
1.62 3.60
V
Power-On Reset Voltage V
POR
V
DD
rising 1.0 1.3 1.6 V
Power-On Reset Hysteresis
V
PORHYST
10 131 300
mV
I
STB
Internal oscillator disabled; SCL,
SDA, digital inputs at V
DD
or
GND; P1–P4 (as inputs) at V
DD
or
GND
0.75 2
Standby Current (Interface Idle)
I
OSC
Internal oscillator enabled; SCL,
SDA, digital inputs at V
DD
or
GND; P1–P4 (as inputs) at V
DD
or
GND
14 25
µA
S up p l y C ur r ent ( Inter face Runni ng ) I
SUP
f
S C L
= 400kH z; other d i g i tal i np uts
at V
DD
or GND
33 40 µA
Input High Voltage SDA, SCL, AD0 V
IH
0.7 x V
DD
V
Input Low Voltage SDA, SCL, AD0 V
IL
0.3 x V
DD
V
Input High Voltage RST, P1–P4 V
IHP
0.7 x V
DD
V
Input Low Voltage RST, P1–P4 V
ILP
0.3 x V
DD
V
Inp ut Leakag e C ur r ent S D A, S C L, AD 0I
IH
, I
IL
V
DD
or GND -1 +1 µA
Input Leakage Current RST, P1–P4
I
IHP
, I
ILP
V
DD
or GND -1 +1 µA
Input Capacitance SDA, SCL, AD0, P1–P4 8 pF
V
DD
= 1.62V, I
SINK
= 3mA 0.06
0.11
V
DD
= 2.5V, I
SINK
= 16mA 0.19 0.4Output Low Voltage P1–P4 V
OL
V
DD
= 3.3V, I
SINK
= 20mA 0.2 0.4
V
V
DD
= 1.62V, I
SOURCE
= 0.5mA
1.55
1.6
V
DD
≥ 2.5V, I
SOURCE
= 5mA
V
D D
- 0.3
2.3Output High Voltage P2, P3, and P4 V
OH
V
DD
≥ 3.3V, I
SOURCE
= 8mA
V
D D
- 0.4
3.1
V
Output Low Voltage SDA
V
OLSDA
I
SINK
= 6mA 0.3 V