Datasheet

PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
8 PDIP P8+1 21-0043 —
8 SO S8+2 21-0041 90-0096
8 CERDIP J8+2 21-0045 —
V
CC
V
OUT
V
BATT
GND
RESET
PFI PFO
WDI
0.065”
[1.651mm]
0.070”
[1.778mm]
MAX703/MAX704 Low-Cost Microprocessor Supervisory
Circuits with Battery Backup
www.maximintegrated.com
Maxim Integrated │ 9
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
Chip Topography
SUBSTRATE MUST BE LEFT UNCONNECTED