Datasheet

meets Level 4 (the highest level) of IEC 1000-4-2,
with-out the need for additional ESD-protection compo-
nents.
The major difference between tests done using the
Human Body Model and IEC 1000-4-2 is higher peak
current in IEC 1000-4-2, because series resistance is
lower in the IEC 1000-4-2 model. Hence, the ESD with-
stand voltage measured to IEC 1000-4-2 is generally
lower than that measured using the Human Body
Model. Figure 7a shows the IEC 1000-4-2 model and
Figure 7b shows the current waveform for the 8kV,
IEC 1000-4-2, Level 4, ESD Contact-Discharge test.
The Air-Gap test involves approaching the device with
a charged probe. The Contact-Discharge method
connects the probe to the device before the probe is
energized.
Machine Model
The Machine Model for ESD tests all pins using a 200pF
storage capacitor and zero discharge resistance. Its
objective is to emulate the stress caused by contact that
occurs with handling and assembly during manufacturing.
MAX6818 µP Interfacing
The MAX6818 has an output enable (EN) input that
allows switch outputs to be three-stated on the µP data
bus until polled by the µP. Also, state changes at the
switch inputs are detected, and an output (CH) goes
low after the debounce period to signal the µP. Figure 4
shows the timing diagram for enabling outputs and read-
ing data. If the output enable is not used, tie EN to GND
to “always enable” the switch outputs. If EN is low, CH is
always high. If a change of state is not required, leave
CH unconnected.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
4 SOT143 U4-1 21-0052 90-0183
6 SOT23 U6-4 21-0058 90-0175
20 SSOP A20-1 21-0056 90-0094
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
V
CC
OUT1
OUT2
OUT3IN3
IN2
IN1
EN
TOP VIEW
OUT4
OUT5
OUT6
OUT7IN7
IN6
IN5
IN4
12
11
9
10
OUT8
CHGND
IN8
MAX6818
SSOP
GND
OUT2IN2
1 6 OUT1
5 V
CC
IN1
MAX6817
SOT23-6
2
3 4
www.maximintegrated.com
Maxim Integrated │ 7
MAX6816/MAX6817/
MAX6818
±15kV ESD-Protected, Single/Dual/Octal,
CMOS Switch Debouncers
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
Chip Information
SUBSTRATE CONNECTED TO GND
PROCESS: BiCMOS
Pin Congurations (continued)