Datasheet
MAX4800A/MAX4802A
Low-Charge-Injection, 8-Channel, High-Voltage
Analog Switches with 20MHz Serial Interface
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to GND.)
V
DD
Logic Supply Voltage........................................-0.3V to +7V
V
PP
- V
NN
Supply Voltage ....................................................220V
V
PP
Positive Supply Voltage......................-0.3V to (V
NN
+ 220V)
V
NN
Negative Supply Voltage ..............................+0.3V to -220V
Logic Inputs LE, CLR, CLK, DIN ..............................-0.3V to +7V
DOUT..........................................................-0.3V to (V
DD
+ 0.3V)
RGND (MAX4802A)...............................................-4.5V to +0.3V
COM_, NO_.................................................................V
NN
to V
PP
Continuous Power Dissipation (T
A
= +70°C)
26-Bump CSBGA (derate 11.8mW/°C above +70°C)..941mW
28-Pin PLCC (derate 10.5mW/°C above +70°C) .........842mW
48-Pin LQFP (derate 22.7mW/°C above +70°C)........1818mW
Operating Temperature Range...............................0°C to +70°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature......................................................+150°C
Lead Temperature (excluding CSBGA, soldering, 10s) ..+300°C
Soldering Temperature (reflow)
28 PLCC.......................................................................+245°C
All other packages.......................................................+260°C
PACKAGE THERMAL CHARACTERISTICS (Note 1)
26 CSBGA
Junction-to-Ambient Thermal Resistance (
θ
J
A
)...........85°C/W
Junction-to-Case Thermal Resistance (
θ
J
C
)................23°C/W
28 PLCC
Junction-to-Ambient Thermal Resistance (
θ
J
A
)...........44°C/W
Junction-to-Case Thermal Resistance (
θ
J
C
)................10°C/W
48 LQFP
Junction-to-Ambient Thermal Resistance (
θ
J
A
)...........44°C/W
Junction-to-Case Thermal Resistance (
θ
J
C
)................10°C/W
ELECTRICAL CHARACTERISTICS
(V
DD
= +2.7V to +6V, V
PP
= +40V to (V
NN
+ 200V), V
NN
= -40V to -160V, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values
are at T
A
= +25°C.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
ANALOG SWITCH
Analog-Signal Range
V
COM_
,
V
NO_
(Note 3)
V
NN
+
10
V
PP
-
10
V
T
A
= 0°C 30
T
A
= +25°C 26 38
I
COM
= 5mA
T
A
= +70°C 48
T
A
= 0°C 25
T
A
= +25°C 22 27
V
PP
= +40V,
V
NN
= -160V,
V
COM_
= 0V
I
COM
=
200mA
T
A
= +70°C 32
T
A
= 0°C 25
T
A
= +25°C 22 27
I
COM
= 5mA
T
A
= +70°C 30
T
A
= 0°C 18
T
A
= +25°C 18 24
Small-Signal Switch
On-Resistance
R
ONS
V
PP
= +100V,
V
NN
= -100V,
V
COM_
= 0V
I
COM
=
200mA
T
A
= +70°C 27
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial
.