Datasheet

MAX328/MAX329
Ultra-Low Leakage Monolithic CMOS
Analog Multiplexers
_______________________________________________________________________________________ 9
Ordering Information (continued)
+ Denotes a lead(Pb)-free/RoHS-compliant package.
* Contact factory for dice specifications.
** EP = Exposed pad.
*** Contact factory for availability. Substrate may be allowed to
be unconnected or be connected to V+.
PART TEMP RANGE PIN-PACKAGE
MAX329CPE+ 0°C to +70°C 16 Plastic DIP
MAX329CWE+ 0°C to +70°C 16 Wide SO
MAX329CJE 0°C to +70°C 16 CERDIP
MAX329C/D 0°C to +70°C Dice*
MAX329ETE+ -40°C to +85°C 16 TQFN-EP**
MAX329EPE+ -40°C to +85°C 16 Plastic DIP
MAX329EWE+ -40°C to +85°C 16 Wide SO
MAX329EJE -40°C to +85°C 16 CERDIP***
MAX329MJE -55°C to +125°C 16 CERDIP***
16
EN
15A0
14A1
13
A2
10 S5 11 V+ 12 GND
9S6
2S1 1V- 3S2 4S3
5S4
+
6
D
7
S8
8S7
MAX328
TOP VIEW
TQFN
16
EN
15A0
14A1
13
GND
10 S2B 11 S1B 12 V+
9 S3B
2S1A 1V- 3S2A 4S3A
5S4A
+
6
DA
7
DB
8 S4B
MAX329
TOP VIEW
TQFN
Pin Configurations (continued)
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages
. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
16 CERDIP J16+3
21-0045
—
16 PDIP P16+2
21-0043
—
16 TQFN-EP T1655+3
21-0140 90-0073
16 Wide SO W16+2
21-0042 90-0107