Datasheet

±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,
Up to 1Mbps, True RS-232 Transceivers
Selector Guide
PART
NO. OF
DRIVERS/
RECEIVERS
LOW-POWER
SHUTDOWN
GUARANTEED
DATA RATE
(bps)
MAX3222E 2/2 ✔ 250k
MAX3232E 2/2 — 250k
MAX3237E
(Normal)
5/3 ✔ 250k
MAX3237E
(MegaBaud)
5/3 ✔ 1M
MAX3241E 3/5 ✔ 250k
MAX3246E 3/5 ✔ 250k
Package Information
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages
. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Ordering Information (continued)
PART TEMP RANGE PIN-PACKAGE
MAX3232ECTE+ 0°C to +70°C
16 TQFN-EP**
(5mm x 5mm)
MAX3232ECUE+ 0°C to +70°C 16 TSSOP
MAX3232ECUP+ 0°C to +70°C 20 TSSOP
MAX3232EEAE+ -40°C to +85°C 16 SSOP
MAX3232EEWE+ -40°C to +85°C 16 Wide SO
MAX3232EEPE+ -40°C to +85°C 16 Plastic DIP
MAX3232EETE+ -40°C to +85°C
16 TQFN-EP**
(5mm x 5mm)
MAX3232EEUE+ -40°C to +85°C 16 TSSOP
MAX3232EEUP+ -40°C to +85°C 20 TSSOP
MAX3237ECAI+ 0°C to +70°C 28 SSOP
MAX3237EEAI+ -40°C to +85°C 28 SSOP
MAX3241ECAI+ 0°C to +70°C 28 SSOP
MAX3241ECWI+ 0°C to +70°C 28 Wide SO
MAX3241ECUI+ 0°C to +70°C 28 TSSOP
MAX3241ECTJ+ 0°C to +70°C
32 TQFN-EP**
(7mm x 7mm)
MAX3241EEAI+ -40°C to +85°C 28 SSOP
MAX3241EEWI+ -40°C to +85°C 28 Wide SO
MAX3241EEUI+ -40°C to +85°C 28 TSSOP
MAX3246ECBX-T+ 0°C to +70°C 6 x 6 UCSP
†
MAX3246EEBX-T+ -40°C to +85°C 6 x 6 UCSP
†
+ Denotes a lead(Pb)-free/RoHS-compliant package.
† Requires solder temperature profile described in the Absolute
Maximum Ratings section. UCSP Reliability is integrally linked
to the user’s assembly methods, circuit board material, and
environment. Refer to the UCSP Reliability Notice in the UCSP
Reliability section of this datasheet for more information.
** EP = Exposed pad.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
20 TQFN T2055+5
20-0140 90-0010
20 TSSOP H20+2
21-0066 90-0116
20 SSOP A20+1
21-0056 90-0094
18 Wide SO W18+1
21-0042 90-0181
18 PDIP P18+5
21-0043
—
16 SSOP A16+2
21-0056 90-0106
16 Wide SO W16+3
21-0042 90-0107
16 PDIP P16+1
21-0043
—
16 TQFN T1655+2
21-0140 90-0072
16 TSSOP U16+1
21-0066 90-0117
28 SSOP A28+1
21-0056 90-0095
28 Wide SO W28+6
21-0042 90-0109
28 TSSOP U28+2
21-0066 90-0171
32 TQFN T3277+2
21-0144 90-0125
6x6 HCSP B36+3
21-0082
Refer to
Application
Note 1891
Chip Information
PROCESS: BICMOS
Maxim Integrated
21
MAX3222E/MAX3232E/MAX3237E/
MAX3241E/MAX3246E