Datasheet

PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
THERMAL RESISTANCE
(SINGLE LAYER BOARD)
THERMAL RESISTANCE
(MULTI LAYER BOARD)
θ
JA
(°C/W) θ
JC
(°C/W) θ
JA
(°C/W) θ
JC
(°C/W)
20 TSSOP
U20+2
21-0066 90-0116
91 20 73.8 20
20 SSOP
A20+1
21-0056 90-0094
125 33 84 32
18 SO
W18+1
21-0042 90-0181
105 22 67 23
18 Plastic Dip
P18+5
21-0043
90 30 NA NA
Dice*
16 TSSOP
U16+1
21-0066 90-0117
106 27 90 27
16 Narrow SO
S16+1
21-0041 90-0097
115 32 75 24
16 Wide SO
W16+1
21-0042 90-0107
105 22 71 23
16 Plastic DIP
P16+1
21-0043
95 35 NA NA
16 Narrow SO
S16+5
21-0041 90-0097
115 32 73 23
16 SSOP
A16+2
21-0056 90-0106
140 34 86 33
16 SSOP
A28+2
21-0056 90-0095
105 24 67 25
28 SSOP
A28+1
21-0056 90-0095
110 25 67.1 25
28 TSSOP
U28+2
21-0066 90-0171
78 13 71.6 13
28 SO
W28+6
21-0042 90-0109
80 18 59 18
28 TSSOP
U28+2
21-0066 90-0171
78 13 71.6 13
Package Information
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
MAX3222/MAX3232/
MAX3237/MAX3241
3.0V to 5.5V, Low-Power, Up to 1Mbps,
True RS-232 Transceivers
www.maximintegrated.com
Maxim Integrated
16