Datasheet
MAX2065
50MHz to 1000MHz High-Linearity, Serial/
Parallel-Controlled Analog/Digital VGA
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
+3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
(
Typical Application Circuit
, high-current (HC) mode, V
CC
= +3.0V to +3.6V, T
C
= -40°C to +85°C. Typical values are at V
CC
= +3.3V
and T
C
= +25°C, unless otherwise noted.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Based on junction temperature T
J
= T
C
+ (θ
JC
x V
CC
x I
CC
). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a printed-circuit board (PCB). See the
Applications Information
section
for details. The junction temperature must not exceed +150°C.
Note 2: Junction temperature T
J
= T
A
+ (θ
JA
x V
CC
x I
CC
). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a 4-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial
.
Note 4: T
C
is the temperature on the exposed pad of the package. T
A
is the ambient temperature of the device and PCB.
VCC_ to GND ........................................................-0.3V to +5.5V
VDD_LOGIC, DATA, CS, CLK, SER/PAR, VDAC_EN,
VREF_SELECT.....................................-0.3V to (VCC_ + 0.3V)
STATE_A, STATE_B, D0–D4 ....................-0.3V to (VCC_ + 0.3V)
AMP_IN, AMP_OUT, VREF_IN,
ANALOG_VCTRL ................................-0.3V to (VCC_ + 0.3V)
ATTEN1_IN, ATTEN1_OUT, ATTEN2_IN,
ATTEN2_OUT...................................................-1.2V to + 1.2V
RSET to GND........................................................-0.3V to + 1.2V
RF Input Power (ATTEN1_IN, ATTEN1_OUT,
ATTEN2_IN, ATTEN2_OUT).......................................+20dBm
RF Input Power (AMP_IN)...............................................+18dBm
Continuous Power Dissipation (Note 1) ...............................6.5W
θ
JA
(Notes 2, 3)..............................................................+38°C/W
θ
JC
(Note 3) ...................................................................+10°C/W
Operating Temperature Range (Note 4).....T
C
= -40°C to +85°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature.........................................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage V
CC
3.0 3.3 3.6 V
Supply Current I
CC
60 80 mA
LOGIC INPUTS (DATA, CS, CLK, VDAC_EN, VREF_SELECT, SER/PAR, STATE_A, STATE_B, D0–D4)
Input High Voltage V
IH
2V
Input Low Voltage V
IL
0.8 V
+5V SUPPLY DC ELECTRICAL CHARACTERISTICS
(
Typical Application Circuit
, V
CC
= +4.75V to +5.25V, T
C
= -40°C to +85°C. Typical values are at V
CC
= +5V and
T
C
= +25°C, unless otherwise noted.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage V
CC
4.75 5 5.25 V
Low-current (LC) mode 73 93
Supply Current I
CC
High-current (HC) mode 124 146
mA
LOGIC INPUTS (DATA, CS, CLK, VDAC_EN, VREF_SELECT, SER/PAR, STATE_A, STATE_B, D0–D4)
Input High Voltage V
IH
3V
Input Low Voltage V
IL
0.8 V
Input Current Logic-High I
IH
-1 +1 µA
Input Current Logic-Low I
IL
-1 +1 µA