Datasheet

MAX16903
2.1MHz, High-Voltage, 1A Mini-Buck Converter
3
Maxim Integrated
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
SUP
= +14V, T
A
= T
J
= -40°C to +125°C, unless otherwise noted. Typical values are at T
A
= +25°C, unless otherwise noted.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial
.
(Voltages referenced to GND.)
SUP, EN..................................................................-0.3V to +42V
BST to LX..................................................................-0.3V to +6V
LX..............................................................-0.3V to (V
SUP
+ 0.3V)
BST .........................................................................-0.3V to +47V
OUTS ......................................................................-0.3V to +12V
SYNC, PGOOD, BIAS............................................-0.3V to +6.0V
PGND to GND .......................................................-0.3V to +0.3V
LX Continuous RMS Current .................................................1.5A
OUTS Short-Circuit Duration ......................................Continuous
ESD Protection
Human Body Model .........................................................±2kV
Machine Model ..............................................................±200V
Continuous Power Dissipation (T
A
= +70°C)
TDFN (derate 24.4 mW/°C above +70°C)......................1951mW
TSSOP (derate 26.1 mW/°C above +70°C) ...................2089mW
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN
Junction-to-Ambient Thermal Resistance (θ
JA
) ...........41°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ..................9°C/W
TSSOP
Junction-to-Ambient Thermal Resistance (θ
JA
) ........38.3°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ..................3°C/W
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
(Note 2) 3.5 28
Supply Voltage Range V
SUP
t < 1s 42
V
EN = low 4 8
EN = high, no load 25 35
µA
Supply Current I
SUP
EN = high, continuous, no switching 1 mA
V
UVLO
Bias rising 2.8 3 3.2
UV Lockout
V
UVLO,HYS
Hysteresis 0.4
V
Bias Voltage V
BIAS
+5.5V  V
SUP
 +42V 5 V
Bias Current Limit I
BIAS
10 mA
BUCK CONVERTER
V
OUT
= 5V, fixed frequency -2.0% 5 +2.5%
V
OUT,5V
V
OUT
= 5V, SKIP mode (Note 3) -2.0% 5 +4%
V
OUT
= 3.3V, fixed frequency -2.0% 3.3 +2.5%
V
OUT,3.3V
V
OUT
= 3.3V, SKIP mode (Note 3)
6V  V
SUP
 18V,
I
LOAD
= 0 to 1A,
T
A
= 0°C to
+125°C
-2.0% 3.3 +4%
V
OUT
= 5V, fixed frequency -3.0% 5 +2.5%
V
OUT,5V
V
OUT
= 5V, SKIP mode (Note 3)
-3.0%
5 +4%
V
OUT
= 3.3V, fixed frequency
-3.0%
3.3 +2.5%
Voltage Accuracy
V
OUT,3.3V
V
OUT
= 3.3V, SKIP mode (Note 3)
6V  V
SUP
 18V,
I
LOAD
= 0 to 1A,
T
A
= -40°C to
+125°C
-3.0%
3.3 +4%
V