Datasheet

2 Maxim Integrated
High-Voltage HB LED Drivers with
Integrated High-Side Current Sense
MAX16833/MAX16833B–MAX16833D
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
IN to PGND ........................................................... -0.3V to +70V
ISENSE+, ISENSE-, DIMOUT to PGND
................ -0.3V to +80V
DIMOUT to ISENSE+
...............................................-9V to +0.3V
ISENSE- to ISENSE+
............................................-0.6V to +0.3V
PGND to SGND
....................................................-0.3V to +0.3V
V
CC
to PGND ..........................................................-0.3V to +9V
NDRV to PGND
........................................ -0.3V to (V
CC
+ 0.3V)
OVP, PWMDIM, COMP, LFRAMP, REF, ICTRL,
RT/SYNC, FLT to SGND
...................................-0.3V to +6.0V
CS to PGND
.........................................................-0.3V to +6.0V
Continuous Current on IN
................................................100mA
Peak Current on NDRV
........................................................ Q3A
Continuous Current on NDRV
....................................... Q100mA
Short-Circuit Duration on V
CC
................................... Continuous
Continuous Power Dissipation (T
A
= +70NC)
16-Pin TSSOP (derate 26.1mW/NC above +70NC)
.....2089mW
Operating Temperature Range
...................... -40NC to +125NC
Junction Temperature
.....................................................+150NC
Storage Temperature Range
............................ -65NC to +150NC
Lead Temperature (soldering, 10s)
................................+300NC
Soldering Temperature (reflow)
......................................+260NC
ELECTRICAL CHARACTERISTICS
(V
IN
= 12V, R
RT
= 12.4kI, C
IN
= C
VCC
= 1µF, C
LFRAMP
/C
REF
= 0.1µF, NDRV = COMP = DIMOUT = PWMDIM = FLT = unconnected,
V
OVP
= V
CS
= V
PGND
= V
SGND
= 0V, V
ISENSE+
= V
ISENSE-
= 45V, V
ICTRL
= 1.40V, T
A
= T
J
= -40NC to +125NC, unless otherwise
noted. Typical values are at T
A
= +25NC.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
16 TSSOP
Junction-to-Ambient Thermal Resistance (q
JA
) .......38.3°C/W
Junction-to-Case Thermal Resistance (q
JC
) .................3°C/W
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
SYSTEM SPECIFICATIONS
Operational Supply Voltage V
IN
5 65 V
Supply Current I
INQ
PWMDIM = 0, no switching 1.5 2.5
mA
Switching 2.5 4
Undervoltage Lockout (UVLO)
UVLOR
IN
V
IN
rising 4.2 4.55 4.85
V
UVLOF
IN
V
IN
falling, I
VCC
= 35mA 4.05 4.3 4.65
UVLO Hysteresis 250 mV
Startup Delay t
START_DELAY
During power-up 410
Fs
UVLO Falling Delay t
FALL_DELAY
During power-down 3.3
Fs
V
CC
LDO REGULATOR
Regulator Output Voltage V
CC
0.1mA P I
VCC
P 50mA, 9V P V
IN
P 14V
6.75 6.95 7.15 V
14V P V
IN
P 65V, I
VCC
= 10mA
Dropout Voltage V
DOVCC
I
VCC
= 50mA, V
IN
= 5V 0.15 0.35 V
Short-Circuit Current I
MAXVCC
V
CC
= 0V, V
IN
= 5V 55 100 150 mA
OSCILLATOR (RT/SYNC)
Switching Frequency Range f
SW
100 1000 kHz
Bias Voltage at RT/SYNC V
RT
1 V
Maximum Duty Cycle D
MAX
V
CS
= 0V; MAX16833/MAX16833B only 87.5 88.5 89.5
%
V
CS
= 0V; MAX16833C/MAX16833D only 93 94 95
Oscillator Frequency Accuracy -5 +5 %