Datasheet

2 Maxim Integrated
Integrated, 4-Channel, High-Brightness LED
Driver with High-Voltage DC-DC Controller
MAX16814
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
IN to SGND ............................................................-0.3V to +45V
EN to SGND
...............................................-0.3V to (V
IN
+ 0.3V)
PGND to SGND
....................................................-0.3V to +0.3V
LEDGND to SGND
...............................................-0.3V to +0.3V
OUT_ to LEDGND
.................................................-0.3V to +45V
V
CC
to SGND .......... -0.3V to the lower of (V
IN
+ 0.3V) and +6V
DRV, FLT, DIM, RSDT, OVP to SGND
.....................-0.3V to +6V
CS, RT, COMP, SETI to SGND
................. -0.3V to (V
CC
+ 0.3V)
NDRV to PGND
.......................................-0.3V to (V
DRV
+ 0.3V)
NDRV Peak Current (< 100ns)
............................................. Q3A
NDRV Continuous Current
............................................ Q100mA
OUT_ Continuous Current
............................................. Q175mA
V
CC
Short-Circuit Duration ........................................Continuous
Continuous Power Dissipation (T
A
= +70NC) (Note 1)
20-Pin TQFN (derate 25.6mW/NC above +70NC)
....... 2051mW
20-Pin Side-Wettable QFND
(derate 26.5mW/NC above +70NC)
............................2050mW
26-Pin TSSOP (derate 26.5mW/NC above +70NC)
..... 2122mW
Operating Temperature Range
MAX16814A_ _
.............................................. -40NC to +125NC
MAX16814BE_ _
............................................. -40NC to +85NC
MAX16814U_ _and MAX16814BU_ _
................0NC to +85NC
Junction Temperature
.....................................................+150NC
Storage Temperature Range
............................ -65NC to +150NC
Lead Temperature (soldering, 10s)
................................+300NC
Soldering Temperature (reflow)
......................................+260NC
ELECTRICAL CHARACTERISTICS
(V
IN
= V
EN
= 12V, R
RT
= 12.25kI, R
SETI
= 15kI, C
VCC
= 1FF, V
CC
= V
DRV
, NDRV = COMP = OUT_ = unconnected, V
RSDT
= V
DIM
= V
CC
, V
OVP
= V
CS
= V
LEDGND
= V
PGND
= V
SGND
= 0V, T
A
= T
J
= -40NC to +125NC for MAX16814A_ _, T
A
= -40NC to +85NC for
MAX16814BE_ _, and T
A
= T
J
= 0NC to +85NC for MAX16814U_ _ and MAX16814BU_ _, unless otherwise noted. Typical values are at
T
A
= +25NC.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to http://www.maximintegrated.com/thermal-tutorial.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
20 TQFN/QFND
Junction-to-Ambient Thermal Resistance (B
JA
) ........ +39NC/W
Junction-to-Case Thermal Resistance (B
JC
) ............... +6NC/W
20 TSSOP
Junction-to-Ambient Thermal Resistance (B
JA
) ..... +37.7NC/W
Junction-to-Case Thermal Resistance (B
JC
) ............ +2.0NC/W
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Operating Voltage Range V
IN
4.75 40 V
Active Supply Current I
IN
MAX16814A_ _ and MAX16814U_ _ 2.5 5
mA
MAX16814B_ _ _ only 2.75 5.5
Standby Supply Current V
EN
= 0V 15 40 µA
IN Undervoltage Lockout V
IN
rising 3.975 4.3 4.625 V
IN UVLO Hysteresis 170 mV
V
CC
REGULATOR
Regulator Output Voltage V
CC
6.5V < V
IN
< 10V, 1mA < I
LOAD
< 50mA
4.75 5.0 5.25 V
10V < V
IN
< 40V, 1mA < I
LOAD
< 10mA
Dropout Voltage V
IN
- V
CC
, V
IN
= 4.75V, I
LOAD
= 50mA 200 500 mV
Short-Circuit Current Limit V
CC
shorted to SGND 100 mA
V
CC
Undervoltage Lockout
Threshold
V
CC
rising 4 V
V
CC
UVLO Hysteresis 100 mV
RT OSCILLATOR
Switching Frequency Range f
SW
200 2000 kHz