Datasheet

MAX16050/MAX16051
Voltage Monitors/Sequencer Circuits with
Reverse-Sequencing Capability
20 ______________________________________________________________________________________
Chip Information
PROCESS: BiCMOS
TOP VIEW
26
27
25
24
10
+
9
11
GND
EN
SET4
OUT4
DISC4
12
V
CC
RESET SET1 OUT1 FAULT DISC1 REM
1
*EP = EXPOSED PAD
2
DISC5
4567
2021 19 17 16 15
OUT5
SET5
OUT2
SET2
DISC3
OUT3
MAX16051
ABP
OV_OUT
3
18
28
8
CP_OUT
SET3
TIMEOUT
23
13
DISC2
DELAY
22
14
EN_HOLD
SHDN
THIN QFN
(4mm x 4mm)
*EP
Pin Configurations (continued)
Package Information
For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages
.
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
28 TQFN T2844-1
21-0139