Datasheet

MAX11120–MAX11128
1Msps, Low-Power, Serial 12-/10-/8-Bit,
4-/8-/16-Channel ADCs
2Maxim Integrated
V
DD
to GND .............................................................-0.3V to +4V
OVDD, AIN0–AIN13, CNVST/AIN14, REF+, REF-/AIN15
to GND ......................-0.3V to the lower of (V
DD
+ 0.3V) and +4V
CS, SCLK, DIN, DOUT, EOC TO GND
..... -0.3V to the Lower of
(V
OVDD
+ 0.3V) and +4V
DGND to GND
...................................................... -0.3V to +0.3V
Input/Output Current (all pins)
...........................................50mA
Continuous Power Dissipation (T
A
= +70NC)
TQFN (derate 34.4mW/NC above +70NC)..................2758mW
Operating Temperature Range
........................ -40NC to +125NC
Junction Temperature
.....................................................+150NC
Storage Temperature Range
............................ -65NC to +150NC
Lead Temperature (soldering, 10s)
................................+300NC
Soldering Temperature (reflow)
......................................+260NC
TQFN
Junction-to-Ambient Thermal Resistance (B
JA
) ........... 29NC/W
Junction-to-Case Thermal Resistance (B
JC
) ..................2NC/W
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
ELECTRICAL CHARACTERISTICS (MAX11122/MAX11125/MAX11128)
(V
DD
= 2.35V to 3.6V, V
OVDD
= 1.5V to 3.6V, f
SAMPLE
= 1Msps, f
SCLK
= 16MHz, 50% duty cycle, V
REF+
= V
DD
, T
A
= -40NC to +125NC,
unless otherwise noted. Typical values are at T
A
= +25NC.) (Note 2)
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DC ACCURACY (Notes 3 and 4)
Resolution RES 12 bit 12 Bits
Integral Nonlinearity INL ±1.0 LSB
Differential Nonlinearity DNL No missing codes ±1.0 LSB
Offset Error 0.7 ±2.5 LSB
Gain Error (Note 5) -0.5 ±4.0 LSB
Offset Error Temperature
Coefficient
OE
TC
±2
ppm/NC
Gain Temperature Coefficient GE
TC
±0.8
ppm/NC
Channel-to-Channel Offset
Matching
±0.5 LSB
Line Rejection PSR (Note 6) ±0.4 ±1.5 LSB/V
DYNAMIC PERFORMANCE (250kHz, input sine wave) (Notes 3 and 7)
Signal-to-Noise Plus Distortion SINAD 70 72.5 dB
Signal-to-Noise Ratio SNR 70 72.6 dB
Total Harmonic Distortion
(Up to the 5th Harmonic)
THD -87 -78 dB
Spurious-Free Dynamic Range SFDR 79 88 dB
Intermodulation Distortion IMD f
1
= 249.878kHz, f
2
= 219.97kHz -85 dB